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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 42897-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nano-thickness film tensile strength test method {译} 微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法 |
China National Standards Microelectromechanical |
 English PDF |
| GB/T 42896-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nanoscale structure impact test method {译} 微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法 |
China National Standards Microelectromechanical |
English PDF |
| GB/T 42895-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS microstructure bending strength test method {译} 微机电系统（MEMS）技术 硅基MEMS微结构弯曲强度试验方法 |
China National Standards Microelectromechanical |
English PDF |
| GB/T 42709.7-2023 |
Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译} 半导体器件 微电子机械器件 第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器 |
China National Standards Microelectromechanical |
English PDF |
| GB/T 42709.5-2023 |
Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件 微电子机械器件 第5部分：射频MEMS开关 |
China National Standards Microelectromechanical |
English PDF |
| GB/T 41852-2022 |
Semiconductor devices; Microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards Microelectromechanical |
English PDF |
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