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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 35010.6-2018 |
Semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分：热仿真要求 |
China National Standards Requirements concerning the |
 English PDF |
| GB/T 26852-2011 |
Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems CAx系统中机电和电气应用之间的互操作要求 |
China National Standards Requirements concerning the |
English PDF |
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