China Semiconductor devices Methods GB Standards List

China "Semiconductor devices Methods" GB Standards List:

Standard Code	Standard Title	Standard Class	Order
GB/T 43493.2-2023	Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects {译} 半导体器件功率器件用碳化硅同质外延片缺陷的无损检测识别判据第2部分：缺陷的光学检测方法	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.26-2023	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) {译} 半导体器件机械和气候试验方法第26部分：静电放电（ESD）敏感度测试人体模型（HBM）	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.23-2023	Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life {译} 半导体器件机械和气候试验方法第23部分：高温工作寿命	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.27-2023	Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) {译} 半导体器件机械和气候试验方法第27部分：静电放电（ESD）敏感度测试机器模型（MM）	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.32-2023	Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) {译} 半导体器件机械和气候试验方法第32部分：塑封器件的易燃性（外部引起的）	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.31-2023	Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) {译} 半导体器件机械和气候试验方法第31部分：塑封器件的易燃性（内部引起的）	China National Standards Semiconductor devices Methods	English PDF
GB/T 15879.604-2023	Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages {译} 半导体器件的机械标准化第6-4部分：表面安装半导体器件封装外形图绘制的一般规则焊球阵列（BGA）封装的尺寸测量方法	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.42-2023	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage {译} 半导体器件机械和气候试验方法第42部分：温湿度贮存	China National Standards Semiconductor devices Methods	English PDF
GB/T 8446.2-2022	Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 电力半导体器件用散热器第2部分：热阻和流阻测量方法	China National Standards Semiconductor devices Methods	English PDF
GB/T 41852-2022	Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.22-2018	Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength 半导体器件机械和气候试验方法第22部分：键合强度	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.21-2018	Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件机械和气候试验方法第21部分：可焊性	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.14-2018	Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）半导体器件机械和气候试验方法第14部分：引出端强度（引线牢固性）	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.201-2018	Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件机械和气候试验方法第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.13-2018	Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件机械和气候试验方法第13部分：盐雾	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.20-2018	Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件机械和气候试验方法第20部分：塑封表面安装器件耐潮湿和焊接热综合影响	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.15-2018	Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件机械和气候试验方法第15部分：通孔安装器件的耐焊接热	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.12-2018	Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件机械和气候试验方法第12部分：扫频振动	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.18-2018	Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件机械和气候试验方法第18部分：电离辐照(总剂量)	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.19-2018	Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件机械和气候试验方法第19部分：芯片剪切强度	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.30-2018	Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件机械和气候试验方法第30部分：非密封表面安装器件在可靠性试验前的预处理	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.17-2018	Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件机械和气候试验方法第17部分：中子辐照	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.11-2018	Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件机械和气候试验方法第11部分：快速温度变化双液槽法	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.4-2012	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件机械和气候试验方法第4部分：强加速稳态湿热试验（HAST）	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.3-2012	Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件机械和气候试验方法第3部分：外部目检	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.2-2006	Semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure 半导体器件机械和气候试验方法第2部分:低气压	China National Standards Semiconductor devices Methods	English PDF
GB/T 4937.1-2006	Semiconductor devices―Mechanical and climatic test methods―Part 1: General 半导体器件机械和气候试验方法第1部分: 总则	China National Standards Semiconductor devices Methods	English PDF
GB/T 15651.3-2003	Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路第5-3部分:光电子器件测试方法	China National Standards Semiconductor devices Methods	English PDF

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