Standard Code | Standard Title | Standard Class | Order |
---|---|---|---|
GB/T 43493.2-2023 |
Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分:缺陷的光学检测方法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.26-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) {译} 半导体器件 机械和气候试验方法 第26部分:静电放电(ESD)敏感度测试 人体模型(HBM) |
China National Standards Test methods semiconductor |
English PDF |
GB/T 42975-2023 |
Semiconductor integrated circuit driver test methods {译} 半导体集成电路 驱动器测试方法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 42848-2023 |
Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers {译} 半导体集成电路 直接数字频率合成器测试方法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.23-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life {译} 半导体器件 机械和气候试验方法 第23部分:高温工作寿命 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.27-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) {译} 半导体器件 机械和气候试验方法 第27部分:静电放电(ESD)敏感度测试 机器模型(MM) |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.32-2023 |
Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) {译} 半导体器件 机械和气候试验方法 第32部分:塑封器件的易燃性(外部引起的) |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.31-2023 |
Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) {译} 半导体器件 机械和气候试验方法 第31部分:塑封器件的易燃性(内部引起的) |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.42-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage {译} 半导体器件 机械和气候试验方法 第42部分:温湿度贮存 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 41852-2022 |
Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.22-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength 半导体器件 机械和气候试验方法 第22部分:键合强度 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.21-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件 机械和气候试验方法 第21部分:可焊性 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.14-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations(lead integrity) 半导体器件 机械和气候试验方法 第14部分:引出端强度(引线牢固性) |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.201-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.13-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件 机械和气候试验方法 第13部分:盐雾 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.20-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.15-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.12-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件 机械和气候试验方法 第12部分:扫频振动 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.18-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件 机械和气候试验方法 第18部分:电离辐照(总剂量) |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.19-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件 机械和气候试验方法 第19部分:芯片剪切强度 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.30-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.17-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件 机械和气候试验方法 第17部分:中子辐照 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.11-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件 机械和气候试验方法 第11部分:快速温度变化 双液槽法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 31359-2015 |
Test methods of semiconductor lasers 半导体激光器测试方法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 13422-2013 |
Semiconductor converters - Electrical test methods 半导体变流器 电气试验方法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 13973-2012 |
General specification test methods for semiconductor device curve tracers 半导体管特性图示仪通用规范 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.4-2012 |
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件 机械和气候试验方法 第4部分:强加速稳态湿热试验(HAST) |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.3-2012 |
Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件 机械和气候试验方法 第3部分:外部目检 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 6616-2009 |
Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge 半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 1555-2009 |
Testing methods for determining the orientation of a semiconductor single crystal 半导体单晶晶向测定方法 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.2-2006 |
Semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure 半导体器件 机械和气候试验方法 第2部分:低气压 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 4937.1-2006 |
Semiconductor devices―Mechanical and climatic test methods―Part 1: General 半导体器件 机械和气候试验方法 第1部分: 总则 |
China National Standards Test methods semiconductor |
English PDF |
GB/T 14862-1993 |
Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits 半导体集成电路封装结到外壳热阻测试方法 |
China National Standards Test methods semiconductor |
English PDF |
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