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GB standards are the China national standards; Prefix code GB are Mandatory standards, GB/T are Recommended standards; All products or service must be compliance with GB standards; If you want to export products or services to huge Chinese market, need ensure they are meet the requirements of GB china national standards;  We provide Chinese GB standards and English version GB standards  Lookup, Translate, Download, Imported Commodity GB standards Testing and Compliance review services.
  •  China "semiconducto" GB Standards List:
  • Standard  Code Standard Title Standard Class Order
    GB/T 8750-2022 Gold-based bonding wire and ribbon for semiconductor packaging
    半导体封装用金基键合丝、带
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    GB/T 34590.11-2022 Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications
    道路车辆 功能安全 第11部分:半导体应用指南
    China National Standards
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    GB/T 41852-2022 semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures
    半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
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    GB/T 41853-2022 semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement
    半导体器件 微机电器件 晶圆间键合强度测量
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    GB/T 8446.3-2022 Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
    电力半导体器件用散热器  第3部分:绝缘件和紧固件
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    GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
    电力半导体器件用散热器  第2部分:热阻和流阻测量方法
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    GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
    电力半导体器件用散热器  第1部分:散热体
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    GB/T 41040-2021 COTS semiconductor parts for space application -- Quality assurance requirements
    宇航用商业现货(COTS)半导体器件 质量保证要求
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    GB/T 21548-2021 Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems
    光通信用高速直接调制半导体激光器的测量方法
    China National Standards
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    GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
    半导体集成电路外形尺寸
    China National Standards
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    GB/T 38345-2019 General design requirements of semiconductor integrate circuit for space application
    宇航用半导体集成电路通用设计要求
    China National Standards
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    GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    半导体器件的机械标准化 第4部分:半导体器件封装外形的分类和编码体系
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    GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    航空电子过程管理 航空航天、国防及其他高性能应用领域(ADHP)电子元器件 第1部分:高可靠集成电路与分立半导体器件通用要求
    China National Standards
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    GB/T 37131-2018 Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
    纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法
    China National Standards
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    GB/T 37031-2018 semiconductor lighting terminology
    半导体照明术语
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    GB/T 11498-2018 semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
    半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)
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    GB/T 14844-2018 Designations of semiconductor materials
    半导体材料牌号表示方法
    China National Standards
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    GB/T 13062-2018 semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
    半导体器件-集成电路-第21-1部分:膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)
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    GB/T 36474-2018 semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)
    半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法
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    GB/T 36477-2018 semiconductor integrated circuit—Measuring methods for flash memory
    半导体集成电路 快闪存储器测试方法
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    GB/T 36360-2018 semiconductor optoelectronic devices--Blank detail specification for middle power light-emitting diodes
    半导体光电子器件 中功率发光二极管空白详细规范
    China National Standards
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    GB/T 36358-2018 semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes
    半导体光电子器件 功率发光二极管空白详细规范
    China National Standards
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    GB/T 36359-2018 semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes
    半导体光电子器件 小功率发光二极管空白详细规范
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    GB/T 4728.5-2018 Graphical symbols for electrical diagrams—Part 5:semiconductors and electron tubes
    电气简图用图形符号 第5部分:半导体管和电子管
    China National Standards
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    GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
    半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值
    China National Standards
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    GB/T 4937.22-2018 semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
    半导体器件 机械和气候试验方法 第22部分:键合强度
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    GB/T 4937.21-2018 semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
    半导体器件 机械和气候试验方法 第21部分:可焊性
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    GB/T 4937.14-2018 semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations(lead integrity)
    半导体器件 机械和气候试验方法 第14部分:引出端强度(引线牢固性)
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    GB/T 4937.201-2018 semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
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    GB/T 4937.13-2018 semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
    半导体器件 机械和气候试验方法 第13部分:盐雾
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    GB/T 4937.20-2018 semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响
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    GB/T 4937.15-2018 semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
    半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热
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    GB/T 4937.12-2018 semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
    半导体器件 机械和气候试验方法 第12部分:扫频振动
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    GB/T 4937.18-2018 semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
    半导体器件 机械和气候试验方法 第18部分:电离辐照(总剂量)
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    GB/T 4937.19-2018 semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
    半导体器件 机械和气候试验方法 第19部分:芯片剪切强度
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    GB/T 4937.30-2018 semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
    半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理
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    GB/T 36646-2018 Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy
    制备氮化物半导体材料用氢化物气相外延设备
    China National Standards
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    GB/T 4937.17-2018 semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
    半导体器件 机械和气候试验方法 第17部分:中子辐照
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    GB/T 4937.11-2018 semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
    半导体器件 机械和气候试验方法 第11部分:快速温度变化 双液槽法
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    GB/T 36005-2018 Measuring methods of optical radiation safety for semiconductor lighting equipments and systems
    半导体照明设备和系统的光辐射安全测试方法
    China National Standards
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    GB/T 35010.2-2018 semiconductor die products—Part 2: Exchange data formats
    半导体芯片产品 第2部分:数据交换格式
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    GB/T 35010.6-2018 semiconductor die products—Part 6: Requirements for concerning thermal simulation
    半导体芯片产品 第6部分:热仿真要求
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    GB/T 35010.8-2018 semiconductor die products—Part8: EXPRESS model schema for data exchange
    半导体芯片产品 第8部分:数据交换的EXPRESS格式
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    GB/T 35007-2018 semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
    半导体集成电路 低电压差分信号电路测试方法
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    GB/T 35006-2018 semiconductor integrated circuits—Measuring method of level converter
    半导体集成电路 电平转换器测试方法
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    GB/T 35010.5-2018 semiconductor die products—Part 5:Requirements for concerning electrical simulation
    半导体芯片产品 第5部分:电学仿真要求
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    GB/T 35010.7-2018 semiconductor die products—Part 7: XML schema for data exchange
    半导体芯片产品 第7部分:数据交换的XML格式
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    GB/T 35010.1-2018 semiconductor die products—Part 1:Requirements for procurement and use
    半导体芯片产品 第1部分:采购和使用要求
    China National Standards
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    GB/T 14028-2018 semiconductor integrated circuits—Measuring method of analogue switch
    半导体集成电路 模拟开关测试方法
    China National Standards
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    GB/T 35010.3-2018 semiconductor die products—Part 3: Guide for handling, packing and storage
    半导体芯片产品 第3部分:操作、包装和贮存指南
    China National Standards
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    GB/T 4377-2018 semiconductor integrated circuits—Measuring method of voltage regulators
    半导体集成电路 电压调整器测试方法
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    GB/T 35010.4-2018 semiconductor die products—Part 4: Requirements for die users and suppliers
    半导体芯片产品 第4部分:芯片使用者和供应商要求
    China National Standards
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    GB/T 15651.4-2017 semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers
    半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器
    China National Standards
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    GB/T 34502-2017 Gold-coated silver and silver alloy bonding wires for semiconductor package
    封装键合用镀金银及银合金丝
    China National Standards
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    GB/T 34507-2017 Palladium coated copper bonding wire for semiconductor package
    封装键合用镀钯铜丝
    China National Standards
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    GB/T 5226.33-2017 Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment
    机械电气安全 机械电气设备 第33部分:半导体设备技术条件
    China National Standards
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    GB/T 34971-2017 Guide for gaseous effluent handling in semiconductor industry
    半导体制造用气体处理指南
    China National Standards
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    GB/T 249-2017 The rule of type designation for discrete semiconductor devices
    半导体分立器件型号命名方法
    China National Standards
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    GB/T 14048.12-2016 Low-voltage switchgear and controlgear—Part 4-3: Contactors and motor-starters—AC semiconductor controllers and contactors for non-motor loads
    低压开关设备和控制设备 第4-3部分:接触器和电动机起动器 非电动机负载用交流半导体控制器和接触器
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    GB/T 32817-2016 semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
    半导体器件 微机电器件 MEMS总规范
    China National Standards
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    GB/T 14048.6-2016 Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters)
    低压开关设备和控制设备 第4-2部分:接触器和电动机起动器 交流电动机用半导体控制器和起动器(含软起动器)
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    GB/T 9425-1988 Blank detail specification for semiconductor inte-grated circuit operational amplifiers
    半导体集成电路运算放大器空白详细规范 (可供认证用)
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    GB/T 9424-1998 semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits,series 4000B and 4000UB
    半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范
    China National Standards
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    GB/T 8750-2014 Gold bonding wire for semiconductor package
    半导体封装用键合金丝
    China National Standards
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    GB/T 8446.3-2004 Heat sink for power semiconductor device--Part 3:Insulators and fasteners
    电力半导体器件用散热器 第3部分:绝缘件和紧固件
    China National Standards
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    GB/T 8446.2-2004 Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference
    电力半导体器件用散热器 第2部分:热阻和流阻测试方法
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    GB/T 8446.1-2004 Heat sink for power semiconductor device--Part 1:Casting kind series
    电力半导体器件用散热器 第1部分:铸造类系列
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    GB/T 7581-1987 Dimensions of outlines for semiconductor discrete devices
    半导体分立器件外形尺寸
    China National Standards
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    GB/T 7576-1998 semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification
    半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范
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    GB/T 7509-1987 Blank detail specification for microprocessor semiconductor integrated circuits
    半导体集成电路微处理器空白详细规范 (可供认证用)
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    GB/T 7423.3-1987 Heat sink of semiconductor devices--Heat sink, staggered fingers shapes
    半导体器件散热器 叉指形散热器
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    GB/T 7423.2-1987 Heat sink of semiconductor devices--Heat sink,extruded shapes
    半导体器件散热器 型材散热器
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    GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification
    半导体器件散热器 通用技术条件
    China National Standards
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    GB/T 7092-1993 Outline dimensions of semiconductor integratedcircuits
    半导体集成电路外形尺寸
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    GB/T 6798-1996 semiconductor integrated circuits--General principles of measuring methods of voltage comparators
    半导体集成电路 电压比较器测试方法的基本原理
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    GB/T 6648-1986 Blank detail specification for semiconductor inte-grated circuit static read/write memories
    半导体集成电路静态读/ 写存储器空白详细规范(可供认证用)
    China National Standards
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    GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge
    半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法
    China National Standards
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    GB/T 6590-1998 semiconductor devices--Discrete devices--Part6:Thyristors--Section Two:Blank detail specification for bidirectional triode thyristors(triacs),ambient or case-rated,up to 100A
    半导体器件 分立器件 第6部分:闸流晶体管 第二篇 100A以下环境或管壳额定的双向三极闸流晶体管空白详细规范
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    GB/T 6589-2002 semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)
    半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范
    China National Standards
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    GB/T 6588-2000 semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes,switching diodes and controlled-avalanche diodes
    半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范
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    GB/T 6571-1995 semiconductordevices--Discrete devices--Part 3:Signal(including switching)and regulator diodes
    半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管
    China National Standards
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    GB/T 6352-1998 semiconductor devices--Discrete devices--Part 6:Thyristors--Section One:Blank detail specification for reverse blocking triode thyristors,ambient or case-rated,up to 100A
    半导体器件 分立器件 第6部分:闸流晶体管 第一篇 100A以下环境或管壳额定反向阻断三极闸流晶体管空白详细规范
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    GB/T 6351-1998 semiconductor devices--Discrete devices--Part 2:Rectifier diodes--Section One:Blank detail specification for rectifier diodes(including avalanche recti fier diodes),ambient and case-rated,up to 100A
    半导体器件 分立器件 第2部分:整流二极管 第一篇 100A以下环境或管壳额定整流二极管(包括雪崩整流二极管)空白详细规范
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    GB/T 6219-1998 semiconductor devices--Discrete devices--Part 8:Field-effect transistors--Section One:Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz
    半导体器件 分立器件 第8部分:场效应晶体管 第一篇 1 GHz、5 W以下的单栅场效应晶体管 空白详细规范
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    GB/T 6217-1998 semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section One:Blank detail speci-fication for ambient-rated bipolar transistors for low and high frequency amplification
    半导体器件 分立器件 第7部分:双极型晶体管 第一篇 高低频放大环境额定的双极型晶体管空白详细规范
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    GB/T 5965-2000 semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
    半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范
    China National Standards
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    GB/T 5839-1986 Rating systems for electronic tubes and semiconductor devices
    电子管和半导体器件额定值制
    China National Standards
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    GB/T 5201-2012 Test procedures for semiconductor charged particle detectors
    带电粒子半导体探测器测量方法
    China National Standards
    semiconducto

    English PDF
    GB/T 4937.4-2012 semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    半导体器件 机械和气候试验方法 第4部分:强加速稳态湿热试验(HAST)
    China National Standards
    semiconducto

    English PDF
    GB/T 4937.3-2012 semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination
    半导体器件 机械和气候试验方法 第3部分:外部目检
    China National Standards
    semiconducto

    English PDF
    GB/T 4937.2-2006 semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure
    半导体器件 机械和气候试验方法 第2部分:低气压
    China National Standards
    semiconducto

    English PDF
    GB/T 4937.1-2006 semiconductor devices―Mechanical and climatic test methods―Part 1: General
    半导体器件 机械和气候试验方法 第1部分: 总则
    China National Standards
    semiconducto

    English PDF
    GB/T 4728.5-2005 Graphical symbols for diagrams Part 5 semiconductors and electron tubes
    电气简图用图形符号 第5部分:半导体管和电子管
    China National Standards
    semiconducto

    English PDF
    GB/T 4589.1-2006 semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
    半导体器件 第10部分:分立器件和集成电路总规范
    China National Standards
    semiconducto

    English PDF
    GB/T 4587-1994 semiconductor discrete devices and integrated circuits--Part 7:Bipolar transistors
    半导体分立器件和集成电路 第7部分:双极型晶体管
    China National Standards
    semiconducto

    English PDF
    GB/T 4586-1994 semiconductor devices--Discrete devices--Part 8:Field-effect transistors
    半导体器件 分立器件 第8部分:场效应晶体管
    China National Standards
    semiconducto

    English PDF
    GB/T 4377-1996 semiconductor integrated circuits--General principles of measuring methods of voltage regulator
    半导体集成电路 电压调整器测试方法的基本原理
    China National Standards
    semiconducto

    English PDF
    GB/T 4326-2006 Extrinsic semiconductor single crystals measurement of Hall mobility and Hall coefficient
    非本征半导体单晶霍尔迁移率和霍尔系数测量方法
    China National Standards
    semiconducto

    English PDF
    GB/T 4298-1984 The activation analysis method for the determination of elemental impurities in semiconductor silicon materials
    半导体硅材料中杂质元素的活化分析方法
    China National Standards
    semiconducto

    English PDF
    GB/T 4023-2015 semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes
    半导体器件 分立器件和集成电路 第2部分:整流二极管
    China National Standards
    semiconducto

    English PDF

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