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  •  China "conduct" GB Standards English PDF List:
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    GB/T 43493.3-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分:缺陷的光致发光检测方法
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    GB/T 43493.2-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分:缺陷的光学检测方法
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    GB/T 43493.1-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分:缺陷分类
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    GB/T 5019.13-2023 Mica-based insulation materials Part 13: High thermal conductivity glass cloth reinforced low-adhesive mica tape
    以云母为基的绝缘材料 第13部分:高导热性玻璃布补强少胶云母带
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    GB/T 43366-2023 General specification for semiconductor discrete devices for aerospace applications
    宇航用半导体分立器件通用规范
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    GB/T 43362-2023 Gas Analysis Micro Thermal conductivity Gas Chromatography
    气体分析 微型热导气相色谱法
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    GB/T 13465.12-2023 Test methods for impermeable graphite materials Part 12: Thermal conductivity
    不透性石墨材料试验方法 第12部分:导热系数
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    GB/T 43332-2023 Safety requirements for conductive charging and discharging of electric vehicles
    电动汽车传导充放电安全要求
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    GB/T 4937.26-2023 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM)
    半导体器件 机械和气候试验方法 第26部分:静电放电(ESD)敏感度测试 人体模型(HBM)
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    GB/T 4587-2023 Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors
    半导体器件 分立器件 第7部分:双极型晶体管
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    GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications
    宇航用半导体集成电路单粒子软错误时域测试方法
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    GB/T 43136-2023 Superabrasive products Grinding wheels for precision scribing of semiconductor chips
    超硬磨料制品 半导体芯片精密划切用砂轮
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    GB/T 43061-2023 Semiconductor integrated circuit PWM controller test method
    半导体集成电路 PWM控制器测试方法
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    GB/T 43040-2023 Semiconductor integrated circuit AC/DC converter test method
    半导体集成电路 AC/DC变换器测试方法
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    GB/T 43035-2023 Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements
    半导体器件 集成电路 第20部分:膜集成电路和混合膜集成电路总规范 第一篇:内部目检要求
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    GB/T 42975-2023 Semiconductor integrated circuit driver test methods
    半导体集成电路 驱动器测试方法
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    GB/T 42974-2023 Semiconductor integrated circuit flash memory (FLASH)
    半导体集成电路 快闪存储器(FLASH)
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    GB/T 42973-2023 Semiconductor integrated circuit Digital-to-analog (DA) converter
    半导体集成电路 数字模拟(DA)转换器
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    GB/T 42970-2023 Semiconductor integrated circuit video encoding and decoding circuit testing method
    半导体集成电路 视频编解码电路测试方法
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    GB/T 27930-2023 Digital communication protocol between off-board conductive chargers and electric vehicles
    非车载传导式充电机与电动汽车之间的数字通信协议
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    GB/T 20870.5-2023 Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators
    半导体器件 第16-5部分:微波集成电路 振荡器
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    GB/T 20870.2-2023 Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers
    半导体器件 第16-2部分:微波集成电路 预分频器
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    GB/T 20870.10-2023 Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures
    半导体器件 第16-10部分:单片微波集成电路技术可接收程序
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    GB/T 20234.4-2023 Connecting devices for conductive charging of electric vehicles Part 4: High-power DC charging interface
    电动汽车传导充电用连接装置 第4部分:大功率直流充电接口
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    GB/T 20234.3-2023 Connecting devices for conductive charging of electric vehicles Part 3: DC charging interface
    电动汽车传导充电用连接装置 第3部分:直流充电接口
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    GB/T 20234.1-2023 Connection devices for conductive charging of electric vehicles Part 1: General requirements
    电动汽车传导充电用连接装置 第1部分:通用要求
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    GB/T 18487.1-2023 Electric vehicle conductive charging systems Part 1: General requirements
    电动汽车传导充电系统 第1部分:通用要求
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    GB/T 15651.6-2023 Semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes
    半导体器件 第5-6部分:光电子器件 发光二极管
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    GB/T 12113-2023 Methods of measurement of touch current and protective conductor current
    接触电流和保护导体电流的测量方法
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    GB/T 42709.19-2023 Semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass
    半导体器件 微电子机械器件 第19部分:电子罗盘
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    GB/T 42629.4-2023 International Code of conduct for Environmental Surveys of Seabed Areas and High Seas Part 4: Survey of Physical Properties of Marine Sediments
    国际海底区域和公海环境调查规程 第4部分:海洋沉积物物理特性调查
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    GB/T 42676-2023 Testing the quality of semiconductor single crystals X-ray diffraction method
    半导体单晶晶体质量的测试 X射线衍射法
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    GB/T 6616-2023 Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method
    半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法
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    GB/T 1555-2023 Semiconductor single crystal crystal orientation determination method
    半导体单晶晶向测定方法
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    GB/T 1553-2023 Determination of minority carrier lifetime in silicon and germanium Photoconductivity decay method
    硅和锗体内少数载流子寿命的测定 光电导衰减法
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    GB/T 42909-2023 conductive adhesive tape for wireless terminal equipment
    无线终端设备用导电胶粘带
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    GB/T 42848-2023 Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers
    半导体集成电路 直接数字频率合成器测试方法
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    GB/T 42839-2023 Semiconductor integrated circuit Analog-to-digital (AD) converter
    半导体集成电路 模拟数字(AD)转换器
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    GB/T 42838-2023 Semiconductor integrated circuit Hall circuit test method
    半导体集成电路 霍尔电路测试方法
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    GB/T 42837-2023 Microwave semiconductor integrated circuit amplifier
    微波半导体集成电路 放大器
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    GB/T 42836-2023 Microwave semiconductor integrated circuit mixer
    微波半导体集成电路 混频器
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    GB/T 42835-2023 Semiconductor integrated circuit system on chip (SoC)
    半导体集成电路 片上系统(SoC)
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    GB/T 42919.6-2023 Plastics - Determination of thermal conductivity and thermal diffusivity - Part 6: Comparative method based on temperature modulation technology
    塑料 导热系数和热扩散系数的测定 第6部分:基于温度调制技术的比较法
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    GB/T 42919.4-2023 Plastics - Determination of thermal conductivity and thermal diffusivity - Part 4: Laser flash method
    塑料 导热系数和热扩散系数的测定 第4部分:激光闪光法
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    GB/T 42919.3-2023 Plastics - Determination of thermal conductivity and thermal diffusivity - Part 3: Temperature wave analysis method
    塑料 导热系数和热扩散系数的测定 第3部分:温度波分析法
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    GB/T 42919.1-2023 Plastics - Determination of thermal conductivity and thermal diffusivity - Part 1: General principles
    塑料 导热系数和热扩散系数的测定 第1部分:通则
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    GB/T 22077-2023 Test method for creep of overhead conductors
    架空导线蠕变试验方法
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    GB/T 42736-2023 Semi-conductive polyolefin heat shrink tubing
    半导电聚烯烃热收缩管
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    GB/T 27671-2023 conductive Copper Profiles
    导电用铜型材
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    GB/T 42747-2023 Superconducting strip photon detector Dark count rate
    超导条带光子探测器 暗计数率
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    GB/T 4937.23-2023 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
    半导体器件 机械和气候试验方法 第23部分:高温工作寿命
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    GB/T 4937.27-2023 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM)
    半导体器件 机械和气候试验方法 第27部分:静电放电(ESD)敏感度测试 机器模型(MM)
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    GB/T 4937.32-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced)
    半导体器件 机械和气候试验方法 第32部分:塑封器件的易燃性(外部引起的)
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    GB/T 4937.31-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin)
    半导体器件 机械和气候试验方法 第31部分:塑封器件的易燃性(内部引起的)
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    GB/T 42706.5-2023 Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers
    电子元器件 半导体器件长期贮存 第5部分:芯片和晶圆
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    GB/T 42706.2-2023 Electronic components - Long-term storage of semiconductor devices - Part 2: Degradation mechanisms
    电子元器件 半导体器件长期贮存 第2部分:退化机理
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    GB/T 42706.1-2023 Electronic components - Long term storage of semiconductor devices - Part 1: General
    电子元器件 半导体器件长期贮存 第1部分:总则
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    GB/T 15879.604-2023 Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages
    半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法
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    GB/T 42629.3-2023 International Code of conduct for Environmental Surveys of Seabed Areas and the High Seas Part 3: Surveys of Marine Life
    国际海底区域和公海环境调查规程 第3部分:海洋生物调查
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    GB/T 42629.2-2023 International Code of conduct for Environmental Surveys of Seabed Areas and the High Seas Part 2: Marine Chemical Surveys
    国际海底区域和公海环境调查规程 第2部分:海洋化学调查
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    GB/T 42629.1-2023 International Code of conduct for Environmental Surveys of Seabed Areas and the High Seas Part 1: General
    国际海底区域和公海环境调查规程 第1部分:总则
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    GB/T 4937.42-2023 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
    半导体器件 机械和气候试验方法 第42部分:温湿度贮存
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    GB/T 42529-2023 Evaluation Requirements for Moisture conduction and Phase Change Breathing Function of New Wall Materials
    新型墙体材料湿传导及相变呼吸功能的评价要求
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    GB/T 42709.7-2023 Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection
    半导体器件 微电子机械器件 第7部分:用于射频控制和选择的MEMS体声波滤波器和双工器
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    GB/T 42709.5-2023 Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches
    半导体器件 微电子机械器件 第5部分:射频MEMS开关
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    GB/T 42483-2023 Determination of thermal conductivity of wood - heat flow method
    木材导热系数的测定 热流法
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    GB/T 42472-2023 Critical current measurement Retained critical current of silver-coated Bi-2223 superconducting wire after double bending at room temperature
    临界电流测量 银包套Bi-2223超导线室温双弯曲后的保留临界电流
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    GB/T 12966-2022 The methods for determining aluminium and aluminium alloys conductivity using eddy current
    铝及铝合金电导率涡流测试方法
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    GB/T 8446.3-2022 Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
    电力半导体器件用散热器  第3部分:绝缘件和紧固件
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    GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
    电力半导体器件用散热器  第2部分:热阻和流阻测量方法
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    GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
    电力半导体器件用散热器  第1部分:散热体
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    GB/T 41958-2022 Dipped canvas - Test method for thermal conductivity
    浸胶帆布 导热性能试验方法
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    GB/T 8750-2022 Gold-based bonding wire and ribbon for semiconductor packaging
    半导体封装用金基键合丝、带
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    GB/T 34590.11-2022 Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications
    道路车辆 功能安全 第11部分:半导体应用指南
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    GB/T 17626.19-2022 Electromagnetic compatibility-Testing and measurement techniques-Part 19: 2kHz~150kHz differential mode conducted disturbance and communication signal immunity test of AC power port
    电磁兼容 试验和测量技术 第19部分:交流电源端口2kHz~150kHz差模传导骚扰和通信信号抗扰度试验
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    GB/T 42275-2022 Cemented carbide - Determination of total carbon content - High frequency combustion infrared absorption method/thermal conductivity method
    硬质合金 总碳量的测定 高频燃烧红外吸收法/热导法
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    GB/T 14048.22-2022 Low-voltage switchgear and controlgear - Part 7-4: Auxiliary devices - PCB terminal blocks for copper conductors
    低压开关设备和控制设备 第7-4部分:辅助器件 铜导体的PCB接线端子排
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    GB/T 41985-2022 230MeV~250MeV superconducting proton cyclotron
    230MeV~250MeV超导质子回旋加速器
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    GB/T 25080-2022 Specification for Niobium-Titanium (Nb-Ti) Alloy Billets and Rods for Superconducting Applications
    超导用铌-钛(Nb-Ti)合金棒坯和棒材规范
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    GB/T 41640-2022 Critical current measurement Second-generation high-temperature superconducting long tape critical current and its uniformity along the length direction
    临界电流测量 第二代高温超导长带临界电流及其沿长度方向均匀性测量
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    GB/T 41079.2-2022 Methods for Determination of Physical Properties of Liquid Metals Part 2: Determination of Electrical conductivity
    液态金属物理性能测定方法 第2部分:电导率的测定
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    GB/T 41880-2022 Plastics - epoxy resins - determination of electrical conductivity of aqueous extracts
    塑料 环氧树脂 水萃取液电导率的测定
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    GB/T 42043-2022 Aerospace - Aluminum alloy and copper-clad aluminum conductors for electrical wires - General performance requirements
    航空航天 电线的铝合金和铜包铝导体 通用性能要求
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    GB/T 41852-2022 Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures
    半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
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    GB/T 41853-2022 Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement
    半导体器件 微机电器件 晶圆间键合强度测量
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    GB/T 40432-2021 conductive on-board charger for electric vehicles
    电动汽车用传导式车载充电机
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    GB/T 40428-2021 Electromagnetic compatibility requirements and test methods of conductive charging for electric vehicles
    电动汽车传导充电电磁兼容性要求和试验方法
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    GB/T 40296-2021 Practical superconducting wires—Twist pitch measurement method of Nb-Ti and Nb3Sn composite superconductors
    实用超导线 铌-钛(Nb-Ti)与铌三锡(Nb3Sn)复合超导体的扭距测量方法
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    GB/T 10715-2021 Belt drives—V-ribbed belts, joined V-belts and V-belts including wide section belts and hexagonal belts—Electrical conductivity of antistatic belts: Characteristics and methods of test
    带传动 多楔带、联组V带及包括宽V带、六角带在内的单根V带 抗静电带的导电性:要求和试验方法
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    GB/T 19010-2021 Quality management—Customer satisfaction—Guidelines for codes of conduct for organizations
    质量管理 顾客满意 组织行为规范指南
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    GB/T 21227-2021 AC loss measurements—Magnetometer methods for hysteresis loss in superconducting multifilamentary composites
    交流损耗测量 多丝复合超导材料磁滞损耗的磁强计测量法
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    GB/T 21548-2021 Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems
    光通信用高速直接调制半导体激光器的测量方法
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    GB/T 17650.2-2021 Test on gases evolved during combustion of materials from cables or optical fiber cables - Part 2: Determination of acidity (by pH measurement) and conductivity
    取自电缆或光缆的材料燃烧时释出气体的试验方法 第2部分:酸度(用pH测量)和电导率的测定
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    GB/T 39862-2021 Test method for thermal conductivity of high thermal conductivity ceramics
    高热导率陶瓷导热系数的检测
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    GB/T 39858-2021 Test method for thermal conductivity of high thermal conductivity ceramics
    隧道预切槽设备
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    GB/T 39843-2021 Electronic characteristic measurements—Local critical current density and its distribution in large-area superconducting films
    电子学特性测量 大面积超导膜的局域临界电流密度及其分布
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    GB/T 39752-2021 Safety requirements and test specifications of electric vehicle conductive supply equipment
    电动汽车供电设备安全要求及试验规范
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    GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
    半导体集成电路外形尺寸
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    conduct

    English PDF
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