China National Standards

China conductor GB Standards English PDF List


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  •  China "conductor" GB Standards English PDF List:
  • Standard  Code Standard Title Standard Class Order
    GB/T 43493.3-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分:缺陷的光致发光检测方法
    China National Standards
    conductor

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    GB/T 43493.2-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分:缺陷的光学检测方法
    China National Standards
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    GB/T 43493.1-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification
    半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分:缺陷分类
    China National Standards
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    GB/T 43366-2023 General specification for semiconductor discrete devices for aerospace applications
    宇航用半导体分立器件通用规范
    China National Standards
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    GB/T 4937.26-2023 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM)
    半导体器件 机械和气候试验方法 第26部分:静电放电(ESD)敏感度测试 人体模型(HBM)
    China National Standards
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    GB/T 4587-2023 Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors
    半导体器件 分立器件 第7部分:双极型晶体管
    China National Standards
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    GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications
    宇航用半导体集成电路单粒子软错误时域测试方法
    China National Standards
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    GB/T 43136-2023 Superabrasive products Grinding wheels for precision scribing of semiconductor chips
    超硬磨料制品 半导体芯片精密划切用砂轮
    China National Standards
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    GB/T 43061-2023 Semiconductor integrated circuit PWM controller test method
    半导体集成电路 PWM控制器测试方法
    China National Standards
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    GB/T 43040-2023 Semiconductor integrated circuit AC/DC converter test method
    半导体集成电路 AC/DC变换器测试方法
    China National Standards
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    GB/T 43035-2023 Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements
    半导体器件 集成电路 第20部分:膜集成电路和混合膜集成电路总规范 第一篇:内部目检要求
    China National Standards
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    GB/T 42975-2023 Semiconductor integrated circuit driver test methods
    半导体集成电路 驱动器测试方法
    China National Standards
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    GB/T 42974-2023 Semiconductor integrated circuit flash memory (FLASH)
    半导体集成电路 快闪存储器(FLASH)
    China National Standards
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    GB/T 42973-2023 Semiconductor integrated circuit Digital-to-analog (DA) converter
    半导体集成电路 数字模拟(DA)转换器
    China National Standards
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    GB/T 42970-2023 Semiconductor integrated circuit video encoding and decoding circuit testing method
    半导体集成电路 视频编解码电路测试方法
    China National Standards
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    GB/T 20870.5-2023 Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators
    半导体器件 第16-5部分:微波集成电路 振荡器
    China National Standards
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    GB/T 20870.2-2023 Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers
    半导体器件 第16-2部分:微波集成电路 预分频器
    China National Standards
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    GB/T 20870.10-2023 Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures
    半导体器件 第16-10部分:单片微波集成电路技术可接收程序
    China National Standards
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    GB/T 15651.6-2023 Semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes
    半导体器件 第5-6部分:光电子器件 发光二极管
    China National Standards
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    GB/T 12113-2023 Methods of measurement of touch current and protective conductor current
    接触电流和保护导体电流的测量方法
    China National Standards
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    GB/T 42709.19-2023 Semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass
    半导体器件 微电子机械器件 第19部分:电子罗盘
    China National Standards
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    GB/T 42676-2023 Testing the quality of semiconductor single crystals X-ray diffraction method
    半导体单晶晶体质量的测试 X射线衍射法
    China National Standards
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    GB/T 6616-2023 Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method
    半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法
    China National Standards
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    GB/T 1555-2023 Semiconductor single crystal crystal orientation determination method
    半导体单晶晶向测定方法
    China National Standards
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    GB/T 42848-2023 Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers
    半导体集成电路 直接数字频率合成器测试方法
    China National Standards
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    GB/T 42839-2023 Semiconductor integrated circuit Analog-to-digital (AD) converter
    半导体集成电路 模拟数字(AD)转换器
    China National Standards
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    GB/T 42838-2023 Semiconductor integrated circuit Hall circuit test method
    半导体集成电路 霍尔电路测试方法
    China National Standards
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    GB/T 42837-2023 Microwave semiconductor integrated circuit amplifier
    微波半导体集成电路 放大器
    China National Standards
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    GB/T 42836-2023 Microwave semiconductor integrated circuit mixer
    微波半导体集成电路 混频器
    China National Standards
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    GB/T 42835-2023 Semiconductor integrated circuit system on chip (SoC)
    半导体集成电路 片上系统(SoC)
    China National Standards
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    GB/T 22077-2023 Test method for creep of overhead conductors
    架空导线蠕变试验方法
    China National Standards
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    GB/T 4937.23-2023 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
    半导体器件 机械和气候试验方法 第23部分:高温工作寿命
    China National Standards
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    GB/T 4937.27-2023 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM)
    半导体器件 机械和气候试验方法 第27部分:静电放电(ESD)敏感度测试 机器模型(MM)
    China National Standards
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    GB/T 4937.32-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced)
    半导体器件 机械和气候试验方法 第32部分:塑封器件的易燃性(外部引起的)
    China National Standards
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    GB/T 4937.31-2023 Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin)
    半导体器件 机械和气候试验方法 第31部分:塑封器件的易燃性(内部引起的)
    China National Standards
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    GB/T 42706.5-2023 Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers
    电子元器件 半导体器件长期贮存 第5部分:芯片和晶圆
    China National Standards
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    GB/T 42706.2-2023 Electronic components - Long-term storage of semiconductor devices - Part 2: Degradation mechanisms
    电子元器件 半导体器件长期贮存 第2部分:退化机理
    China National Standards
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    GB/T 42706.1-2023 Electronic components - Long term storage of semiconductor devices - Part 1: General
    电子元器件 半导体器件长期贮存 第1部分:总则
    China National Standards
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    GB/T 15879.604-2023 Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages
    半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法
    China National Standards
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    GB/T 4937.42-2023 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
    半导体器件 机械和气候试验方法 第42部分:温湿度贮存
    China National Standards
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    GB/T 42709.7-2023 Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection
    半导体器件 微电子机械器件 第7部分:用于射频控制和选择的MEMS体声波滤波器和双工器
    China National Standards
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    GB/T 42709.5-2023 Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches
    半导体器件 微电子机械器件 第5部分:射频MEMS开关
    China National Standards
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    GB/T 8446.3-2022 Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
    电力半导体器件用散热器  第3部分:绝缘件和紧固件
    China National Standards
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    GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
    电力半导体器件用散热器  第2部分:热阻和流阻测量方法
    China National Standards
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    GB/T 8446.1-2022 Heat sinks for power semiconductor devices—Part 1: Radiators
    电力半导体器件用散热器  第1部分:散热体
    China National Standards
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    GB/T 8750-2022 Gold-based bonding wire and ribbon for semiconductor packaging
    半导体封装用金基键合丝、带
    China National Standards
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    GB/T 34590.11-2022 Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications
    道路车辆 功能安全 第11部分:半导体应用指南
    China National Standards
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    GB/T 14048.22-2022 Low-voltage switchgear and controlgear - Part 7-4: Auxiliary devices - PCB terminal blocks for copper conductors
    低压开关设备和控制设备 第7-4部分:辅助器件 铜导体的PCB接线端子排
    China National Standards
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    GB/T 42043-2022 Aerospace - Aluminum alloy and copper-clad aluminum conductors for electrical wires - General performance requirements
    航空航天 电线的铝合金和铜包铝导体 通用性能要求
    China National Standards
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    GB/T 41852-2022 Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures
    半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
    China National Standards
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    GB/T 41853-2022 Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement
    半导体器件 微机电器件 晶圆间键合强度测量
    China National Standards
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    GB/T 40296-2021 Practical superconducting wires—Twist pitch measurement method of Nb-Ti and Nb3Sn composite superconductors
    实用超导线 铌-钛(Nb-Ti)与铌三锡(Nb3Sn)复合超导体的扭距测量方法
    China National Standards
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    GB/T 21548-2021 Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems
    光通信用高速直接调制半导体激光器的测量方法
    China National Standards
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    GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits
    半导体集成电路外形尺寸
    China National Standards
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    GB/T 41040-2021 COTS semiconductor parts for space application -- Quality assurance requirements
    宇航用商业现货(COTS)半导体器件 质量保证要求
    China National Standards
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    GB/T 40819-2021 Aeolian vibration fatigue test method for overhead conductors and cables
    架空线缆微风振动疲劳试验方法
    China National Standards
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    GB/T 39187-2020 Jack up conductor/blow out preventer tension compensation system
    自升式平台隔水管/防喷器张力补偿系统
    China National Standards
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    GB/T 25085.4-2020 Road vehicles—Automotive cables—Part 4: Dimensions and requirements for 30 V a.c. or 60 V d.c. single-core aluminium conductor cables
    道路车辆 汽车电缆 第4部分:交流30 V或直流60 V单芯铝导体电缆的尺寸和要求
    China National Standards
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    GB/T 38841-2020 Mechanical properties measurement—Room temperature tensile test of reacted Nb3Sn composite superconductors
    力学性能测量 反应后的Nb3Sn复合超导线室温拉伸试验方法
    China National Standards
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    GB/T 25085.3-2020 Road vehicles—Automotive cables—Part 3: Dimensions and requirements for 30 V a.c. or 60 V d.c. single-core copper conductor cables
    道路车辆 汽车电缆 第3部分:交流30 V或直流60 V单芯铜导体电缆的尺寸和要求
    China National Standards
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    GB/T 5584.4-2020 Rectangular copper or aluminium and its alloy wires for electrical purposes—Part 4: Strip copper conductor
    电工用铜、铝及其合金扁线 第4部分:铜带
    China National Standards
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    GB/T 25897-2020 Residual resistance ratio measurement—Residual resistance ratio of Nb-Ti and Nb3Sn composite superconductors
    剩余电阻比测量 铌-钛(Nb-Ti)和铌三锡(Nb3Sn)复合超导体剩余电阻比测量
    China National Standards
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    GB/T 33588.4-2020 Lightning protection system components (LPSC)—Part 4: Requirements for conductor fasteners
    雷电防护系统部件(LPSC)第4部分:导体的紧固件要求
    China National Standards
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    GB/T 33588.2-2020 Lightning protection system components (LPSC)—Part 2: Requirements for air-termination systems,down-conductors and earth electrodes
    雷电防护系统部件(LPSC)第2部分:接闪器、引下线和接地极的要求
    China National Standards
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    GB/T 38345-2019 General design requirements of semiconductor integrate circuit for space application
    宇航用半导体集成电路通用设计要求
    China National Standards
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    GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    半导体器件的机械标准化 第4部分:半导体器件封装外形的分类和编码体系
    China National Standards
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    GB/T 37329-2019 Aluminum alloy wire for the conductor of electric security fence
    电子围栏导体用铝合金线材
    China National Standards
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    GB/T 37751.33-2019 Residual current operated circuit-breakers for household and similar use—Part 3-3: Specific requirements for RCDs with screw-type terminals for external untreated aluminium conductors and with aluminium screw-type terminals for use with copper or with alu
    家用和类似用途的剩余电流动作断路器 第3-3部分:具有连接外部未经处理铝导线的螺纹型接线端子和连接铜或铝导线的铝制螺纹型接线端子RCD的特殊要求
    China National Standards
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    GB/T 37751.31-2019 Residual current operated circuit-breakers for household and similar use—Part 3-1:Particular requirements for RCDs with screwless-type terminals for external copper conductors
    家用和类似用途的剩余电流动作断路器 第3-1部分:具有连接外部铜导线的无螺纹型接线端子的RCD的特殊要求
    China National Standards
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    GB/T 4026-2019 Basic and safety principles for man-machine interface, marking and identification—Identification of equipment terminals, conductor terminations and conductors
    人机界面标志标识的基本和安全规则 设备端子、导体终端和导体的标识
    China National Standards
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    GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    航空电子过程管理 航空航天、国防及其他高性能应用领域(ADHP)电子元器件 第1部分:高可靠集成电路与分立半导体器件通用要求
    China National Standards
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    GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
    半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)
    China National Standards
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    GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
    半导体器件-集成电路-第21-1部分:膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序)
    China National Standards
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    GB/T 14844-2018 Designations of semiconductor materials
    半导体材料牌号表示方法
    China National Standards
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    GB/T 37131-2018 Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
    纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法
    China National Standards
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    GB/T 37031-2018 Semiconductor lighting terminology
    半导体照明术语
    China National Standards
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    GB/T 20141-2018 Formed wire concentric lay overhead electrical stranded conductors
    型线同心绞架空导线
    China National Standards
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    GB/T 36279-2018 Methods for testing self-damping characteristics of overhead conductors
    架空导线自阻尼特性测试方法
    China National Standards
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    GB/T 36474-2018 Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM)
    半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法
    China National Standards
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    GB/T 36477-2018 Semiconductor integrated circuit—Measuring methods for flash memory
    半导体集成电路 快闪存储器测试方法
    China National Standards
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    GB/T 36551-2018 Calculation methods for properties of concentric lay overhead electrical stranded conductors
    同心绞架空导线性能计算方法
    China National Standards
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    GB/T 4728.3-2018 Graphical symbols for electrical diagrams—Part 3:conductors and connecting devices
    电气简图用图形符号 第3部分: 导体和连接件
    China National Standards
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    GB/T 36360-2018 Semiconductor optoelectronic devices--Blank detail specification for middle power light-emitting diodes
    半导体光电子器件 中功率发光二极管空白详细规范
    China National Standards
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    GB/T 36358-2018 Semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes
    半导体光电子器件 功率发光二极管空白详细规范
    China National Standards
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    GB/T 36359-2018 Semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes
    半导体光电子器件 小功率发光二极管空白详细规范
    China National Standards
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    GB/T 4728.5-2018 Graphical symbols for electrical diagrams—Part 5:Semiconductors and electron tubes
    电气简图用图形符号 第5部分:半导体管和电子管
    China National Standards
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    GB/T 36292-2018 Greases for overhead conductors
    架空导线用防腐脂
    China National Standards
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    GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
    半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值
    China National Standards
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    GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
    半导体器件 机械和气候试验方法 第22部分:键合强度
    China National Standards
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    GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
    半导体器件 机械和气候试验方法 第21部分:可焊性
    China National Standards
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    GB/T 11313.11-2018 Radio-frequency connectors—Part 11:Sectional specification for RF coaxial connectors with inner diameter of outer conductor 9.5mm (0.374in) with screw coupling with characteristic impedance 50Ω (type 4.1/9.5)
    射频连接器 第11部分:外导体内径为9.5mm(0.374in)、特性阻抗为50Ω、螺纹连接的射频同轴连接器(4.1/9.5型)分规范
    China National Standards
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    GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations(lead integrity)
    半导体器件 机械和气候试验方法 第14部分:引出端强度(引线牢固性)
    China National Standards
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    English PDF
    GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
    China National Standards
    conductor

    English PDF
    GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
    半导体器件 机械和气候试验方法 第13部分:盐雾
    China National Standards
    conductor

    English PDF
    GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响
    China National Standards
    conductor

    English PDF
    GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
    半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热
    China National Standards
    conductor

    English PDF
    GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
    半导体器件 机械和气候试验方法 第12部分:扫频振动
    China National Standards
    conductor

    English PDF
    GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
    半导体器件 机械和气候试验方法 第18部分:电离辐照(总剂量)
    China National Standards
    conductor

    English PDF
    GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
    半导体器件 机械和气候试验方法 第19部分:芯片剪切强度
    China National Standards
    conductor

    English PDF
    GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
    半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理
    China National Standards
    conductor

    English PDF

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