China National Standards

China solder GB Standards English PDF List


GB standards are the China national standards; Prefix code GB are Mandatory standards, GB/T are Recommended standards; All products or service must be compliance with GB standards; If you want to export products or services to huge Chinese market, need ensure they are meet the requirements of GB china national standards;  We provide Chinese GB standards and English version GB standards  Lookup, Translate, Download, Imported Commodity GB standards Testing and Compliance review services.
  •  China "solder" GB Standards English PDF List:
  • Standard  Code Standard Title Standard Class Order
    GB/Z 41275.23-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics
    航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分:无铅及混装电子产品返工/修复指南
    China National Standards
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    GB/Z 41275.22-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solders Part 22: Technical Guide
    航空电子过程管理 含无铅焊料航空航天及国防电子系统 第22部分:技术指南
    China National Standards
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    GB/Z 41275.4-2023 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solder Part 4: Ball Grid Array Ball Installation
    航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分:球栅阵列植球
    China National Standards
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    GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance
    微电子技术用贵金属浆料测试方法 第7部分:可焊性、耐焊性测定
    China National Standards
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    GB/T 41275.3-2022 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solder Part 3: System Performance Test Methods Containing Lead-Free Solder and Lead-Free Pins
    航空电子过程管理 含无铅焊料航空航天及国防电子系统 第3部分:含无铅焊料和无铅管脚的系统性能试验方法
    China National Standards
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    GB/T 41275.21-2022 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solders Part 21: Guidelines for Transitioning to Lead-Free Electronics
    航空电子过程管理 含无铅焊料航空航天及国防电子系统 第21部分:向无铅电子过渡指南
    China National Standards
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    GB/T 41275.2-2022 Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free solders Part 2: Reducing the Harmful Effects of Tin
    航空电子过程管理 含无铅焊料航空航天及国防电子系统 第2部分:减少锡有害影响
    China National Standards
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    GB/T 38265.3-2022 Test methods for soldering fluxes - Part 3: Determination of acid value - Potentiometric and visual titration
    软钎剂试验方法 第3部分:酸值的测定 电位滴定法和目视滴定法
    China National Standards
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    GB/T 38265.17-2022 soldering flux test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test for flux residues
    软钎剂试验方法 第17部分:钎剂残留物的表面绝缘电阻梳刷试验和电化学迁移试验
    China National Standards
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    GB/T 38265.9-2022 Test methods for soldering fluxes - Part 9: Determination of ammonia content
    软钎剂试验方法 第9部分:氨含量的测定
    China National Standards
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    GB/T 38265.8-2022 Test methods for soldering fluxes - Part 8: Determination of zinc content
    软钎剂试验方法 第8部分:锌含量的测定
    China National Standards
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    GB/T 38265.6-2022 Test methods for soldering fluxes - Part 6: Determination of halide (excluding fluoride) content
    软钎剂试验方法 第6部分:卤化物(不包括氟化物)含量的测定
    China National Standards
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    GB/T 15829-2021 Soft soldering flux -- Classification and requirements
    软钎剂 分类与性能要求
    China National Standards
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    GB/T 41104.3-2021 solder wire, solid and flux cored -- Specifications and test methods -- Part 3: Wetting balance test method for flux cored solder wire efficacy
    实心和药芯软钎料丝? 规范和试验方法? 第3部分:药芯软钎料丝功效的润湿平衡试验方法
    China National Standards
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    GB/T 41104.2-2021 solder wire, solid and flux cored -- Specification and test methods -- Part 2: Determination of flux content
    实心和药芯软钎料丝? 规范和试验方法? 第2部分:钎剂含量的测定
    China National Standards
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    GB/T 41104.1-2021 solder wire, solid and flux cored -- Specification and test methods -- Part 1: Classification and performance requirements
    实心和药芯软钎料丝? 规范和试验方法? 第1部分:分类和性能要求
    China National Standards
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    GB/T 38265.15-2021 Test methods for soft soldering fluxes—Part 15: Copper corrosion test
    软钎剂试验方法 第15部分:铜腐蚀试验
    China National Standards
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    GB/T 38265.14-2021 Test methods for soft soldering fluxes—Part 14: Assessment of tackiness of flux residues
    软钎剂试验方法 第14部分:钎剂残留物胶粘性的评价
    China National Standards
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    GB/T 38265.13-2021 Test methods for soft soldering fluxes—Part 13: Determination of flux spattering
    软钎剂试验方法 第13部分:钎剂溅散性的测定
    China National Standards
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    GB/T 38265.11-2021 Test methods for soft soldering fluxes—Part 11: Solubility of flux residues
    软钎剂试验方法 第11部分:钎剂残留物的可溶性
    China National Standards
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    GB/T 38265.5-2021 Test methods for soft soldering fluxes -- Part 5: Copper mirror test
    软钎剂试验方法 第5部分:铜镜试验
    China National Standards
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    GB/T 9491-2021 Flux for tin soldering
    锡焊用助焊剂
    China National Standards
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    GB/T 3131-2020 Tin-lead solder
    锡铅钎料
    China National Standards
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    GB/T 38265.2-2019 Test methods for soft soldering fluxes—Part 2: Determination of non-volatile matter—Ebulliometric method
    软钎剂试验方法 第2部分:不挥发物质含量的测定 沸点法
    China National Standards
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    GB/T 38265.1-2019 Test methods for soft soldering fluxes—Part 1:Determination of non-volatile matter—Gravimetric method
    软钎剂试验方法 第1部分:不挥发物质含量的测定 重量法
    China National Standards
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    GB/T 38265.16-2019 Test methods for soft soldering fluxes—Part 16:Flux efficacy test—Wetting balance method
    软钎剂试验方法 第16部分:软钎剂润湿性能 润湿平衡法
    China National Standards
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    GB/T 38265.10-2019 Test methods for soft soldering fluxes—Part 10:Flux efficacy test—Solder spread method
    软钎剂试验方法 第10部分:软钎剂润湿性能 铺展试验方法
    China National Standards
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    GB/T 38265.1-2019 Test methods for soft soldering fluxes—Part 1:Determination of non-volatile matter—Gravimetric method
    软钎剂试验方法 第1部分:不挥发物质含量的测定 重量法
    China National Standards
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    GB/T 20422-2018 Lead-free solders
    无铅钎料
    China National Standards
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    GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: solderability
    半导体器件 机械和气候试验方法 第21部分:可焊性
    China National Standards
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    GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
    China National Standards
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    GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响
    China National Standards
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    GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
    半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热
    China National Standards
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    GB/T 10574.10-2017 Methods for chemical analysis of tin-lead solders—Part 10:Determination of cadmium content—Flame atomic absorption spectrometry and Na2EDTA titration method
    锡铅焊料化学分析方法 第10部分:镉量的测定 火焰原子吸收光谱法和Na2EDTA滴定法
    China National Standards
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    GB/T 10574.13-2017 Methods for chemical analysis of tin-lead solders—Part 13:Determination of antimony,bismuth,iron,arsenic,copper,silver,zinc,aluminium,cadmium,phosphorous and gold contents—Inductively coupled plasma atomic emission spectrometric method
    锡铅焊料化学分析方法 第13部分:锑、铋、铁、砷、铜、银、锌、铝、镉、磷和金量的测定 电感耦合等离子体原子发射光谱法
    China National Standards
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    GB/T 10574.9-2017 Methods for chemical analysis of tin-lead solders—Part 9:Determination of aluminium content—Graphite furnace atomic absorption spectrometric method
    锡铅焊料化学分析方法 第9部分:铝量的测定 电热原子吸收光谱法
    China National Standards
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    GB/T 10574.7-2017 Methods for chemical analysis of tin-lead solders—Part 7:Determination of silver content—Flame atomic absorption spectrometry and potassium thiocyanate potentiometric titration
    锡铅焊料化学分析方法 第7部分:银量的测定 火焰原子吸收光谱法和硫氰酸钾电位滴定法
    China National Standards
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    GB/T 10574.12-2017 Methods for chemical analysis of tin-lead solders—Part 12:Determination of sulfur content—High frequency combustion with infrared absorption method
    锡铅焊料化学分析方法 第12部分:硫量的测定 高频燃烧红外吸收光谱法
    China National Standards
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    GB/T 10574.14-2017 Methods for chemical analysis of tin-lead solders—Part 14:Determination of tin, lead,antimony,bismuth,silver,copper,zinc,cadmium and arsenic content—Optical emission spectrometry
    锡铅焊料化学分析方法 第14部分:锡、铅、锑、铋、银、铜、锌、镉和砷量的测定 光电发射光谱法
    China National Standards
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    GB/T 10574.11-2017 Methods for chemical analysis of tin-lead solders—Part 11:Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdeum heteropoly acid spectrophotometry
    锡铅焊料化学分析方法 第11部分:磷量的测定 结晶紫-磷钒钼杂多酸分光光度法
    China National Standards
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    GB/T 10574.8-2017 Methods for chemical analysis of tin-lead solders—Part 8:Determination of zinc content—Flame atomic absorption spectrometric method
    锡铅焊料化学分析方法 第8部分:锌量的测定 火焰原子吸收光谱法
    China National Standards
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    GB/T 33148-2016 soldering and brazing terms
    钎焊术语
    China National Standards
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    GB/T 18290.5-2015 solderless connections—Part 5: Press-in connections—General requirements, test methods and practical guidance
    无焊连接 第5部分:压入式连接 一般要求、试验方法和使用导则
    China National Standards
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    GB/T 18290.4-2015 solderless connections— Part 4: Solderless non-accessible insulation displacement connections— General requirements, test methods and practical guidance
    无焊连接 第4部分:不可接触无焊绝缘位移连接 一般要求、试验方法和使用导则
    China National Standards
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    GB/T 18290.2-2015 solderless connections— Part 2:Crimped connections—General requirements,test methods and practical guidance
    无焊连接 第2部分:压接连接 一般要求、试验方法和使用导则
    China National Standards
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    GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly
    电子装联高质量内部互连用焊料
    China National Standards
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    GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly
    电子装联高质量内部互连用焊锡膏
    China National Standards
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    GB/T 31474-2015 soldering fluxes for high-quality interconnections in electronics assembly
    电子装联高质量内部互连用助焊剂
    China National Standards
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    GB/T 8012-2013 Casting tin-lead solders
    铸造锡铅焊料
    China National Standards
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    GB/T 29089-2012 Spherical tin-solder powder
    球形焊锡粉
    China National Standards
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    GB/T 28770-2012 Test methods for solders
    软钎料试验方法
    China National Standards
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    GB/T 4909.12-2009 Test methods for bare wires - Part 12: solderability test of coating - Solder globule method
    裸电线试验方法 第12部分:镀层可焊性试验-焊球法
    China National Standards
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    GB/T 2424.17-2008 Environmental testing - Part 2: Tests methods guidance on - Test T: soldering Test
    电工电子产品环境试验 第2部分:试验方法 试验T:锡焊试验导则
    China National Standards
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    GB/T 11018.2-2008 Copper winding wires with silk covering - Part 2: Bunched solderable polyurethane enamelled round copper wires, class130, with silk covering
    丝包铜绕组线 第2部分:130级丝包直焊聚氨酯漆包束线
    China National Standards
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    GB/T 7157-2008 Electric soldering irons
    电烙铁
    China National Standards
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    GB/T 15829-2008 Soft soldering flux - Classification and requirements
    软钎剂 分类与性能要求
    China National Standards
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    GB/T 11363-2008 Test method of the strength for brazed and soldered joint
    钎焊接头强度试验方法
    China National Standards
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    GB/T 6109.9-2008 Enamelled round winding wire - Part 9:solderable polyurethane enamelled round copper wire overcoated with polyamide,class 130
    漆包圆绕组线 第9部分:130级聚酰胺复合直焊聚氨酯漆包铜圆线
    China National Standards
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    GB/T 6109.4-2008 Enamelled round winding wire - Part 4:solderable polyurethane enamelled round copper wire,class 130
    漆包圆绕组线 第4部分:130级直焊聚氨酯漆包铜圆线
    China National Standards
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    GB/T 6109.23-2008 Enamelled round winding wire - Part 23: solderable polyurethane enamelled round copper wire,class 180
    漆包圆绕组线 第23部分:180级直焊聚氨酯漆包铜圆线
    China National Standards
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    GB/T 6109.17-2008 Enamelled round winding wire - Part 17: solderable polyesterimide enamelled round copper wire,class 180,with a bonding layer
    漆包圆绕组线 第17部分:180级自粘性直焊聚酯亚胺漆包铜圆线
    China National Standards
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    GB/T 6109.16-2008 Enamelled round winding wire - Part 16: solderable polyurethane enamelled round copper wire,class 155,with a bonding layer
    漆包圆绕组线 第16部分:155级自粘性直焊聚氨酯漆包铜圆线
    China National Standards
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    GB/T 6109.15-2008 Enamelled round winding wire - Part 15:solderable polyurethane enamelled round copper wire,class 130,with a bonding layer
    漆包圆绕组线 第15部分:130级自粘性直焊聚氨酯漆包铜圆线
    China National Standards
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    GB/T 6109.13-2008 Enamelled round winding wire - Part 13: solderable polyesterimide enamelled round copper wire,class 180
    漆包圆绕组线 第13部分:180级直焊聚酯亚胺漆包铜圆线
    China National Standards
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    GB/T 6109.11-2008 Enamelled round winding wire - Part 11: solderable polyurethane enamelled round copper wire overcoated with polyamide,class 155
    漆包圆绕组线 第11部分:155级聚酰胺复合直焊聚氨酯漆包铜圆线
    China National Standards
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    GB/T 6109.10-2008 Enamelled round winding wire - Part 10: solderable polyurethane enamelled round copper wire,class 155
    漆包圆绕组线 第10部分:155级直焊聚氨酯漆包铜圆线
    China National Standards
    solder

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    GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance
    微电子技术用贵金属浆料测试方法 可焊性、耐焊性测定
    China National Standards
    solder

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    GB/T 2423.32-2008 Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: solderability test by the wetting balance method
    电工电子产品环境试验 第2部分:试验方法 试验Ta: 润湿称量法可焊性
    China National Standards
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    GB/T 20422-2006 Lead-free solders
    无铅钎料
    China National Standards
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    GB/T 2423.28-2005 Basic environmental testing procedures for electric and electronic products-Part2:Test methods-Test T:soldering
    电工电子产品环境试验 第2部分:试验方法 试验T:锡焊
    China National Standards
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    GB/T 19247.4-2003 Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies
    印制板组装 第4部分:分规范 引出端焊接组装的要求
    China National Standards
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    GB/T 19247.3-2003 Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies
    印制板组装 第3部分:分规范 通孔安装焊接组装的要求
    China National Standards
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    GB/T 19247.2-2003 Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies
    印制板组装 第2部分: 分规范 表面安装焊接组装的要求
    China National Standards
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    GB/T 19247.1-2003 Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求
    China National Standards
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    GB/T 10574.9-2003 Methods for chemical analysis of tin-lead solders--Determination of aluminum content
    锡铅焊料化学分析方法 铝量的测定
    China National Standards
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    GB/T 10574.8-2003 Methods for chemical analysis of tin-lead solders--Determination of zinc content
    锡铅焊料化学分析方法 锌量的测定
    China National Standards
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    GB/T 10574.7-2003 Methods for chemical analysis of tin-lead solders--Determination of silver content
    锡铅焊料化学分析方法 银量的测定
    China National Standards
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    GB/T 10574.6-2003 Methods for chemical analysis of tin-lead solders--Determination of copper content
    锡铅焊料化学分析方法 铜量的测定
    China National Standards
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    GB/T 10574.5-2003 Methods for chemical analysis of tin-lead solders--Determination of arsenic content
    锡铅焊料化学分析方法 砷量的测定
    China National Standards
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    GB/T 10574.4-2003 Methods for chemical analysis of tin-lead solders--Determination of iron content
    锡铅焊料化学分析方法 铁量的测定
    China National Standards
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    GB/T 10574.3-2003 Methods for chemical analysis of tin-lead solders--Determination of bismuth content
    锡铅焊料化学分析方法 铋量的测定
    China National Standards
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    GB/T 10574.2-2003 Methods for chemical analysis of tin-lead solders--Determination of antimony content
    锡铅焊料化学分析方法 锑量的测定
    China National Standards
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    GB/T 10574.13-2003 Methods for chemical analysis of tin-lead solders--Determination of copper,iron,cadmium,silver,gold,arsenic,zinc,aluminium,bismuth,phosphorous content
    锡铅焊料化学分析方法 铜、铁、镉、银、金、砷、锌、铝、铋、磷量的测定
    China National Standards
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    GB/T 10574.12-2003 Methods for chemical analysis of tin-lead solders--Determination of sulphur content
    锡铅焊料化学分析方法 硫量的测定
    China National Standards
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    GB/T 10574.1-2003 Methods for chemical analysis of tin-lead solders--Determination of tin content
    锡铅焊料化学分析方法 锡量的测定
    China National Standards
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    GB/T 10574.11-2003 Methods for chemical analysis of tin-lead solders--Determination of phosphorus content
    锡铅焊料化学分析方法 磷量的测定
    China National Standards
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    GB/T 10574.10-2003 Methods for chemical analysis of tin-lead solders--Determination of cadmium content
    锡铅焊料化学分析方法 镉量的测定
    China National Standards
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    GB/T 9491-2002 Liquid flux for soldering(Rosin base)
    锡焊用液态焊剂(松香基)
    China National Standards
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    GB/T 3131-2001 Tin-lead solder
    锡铅钎料
    China National Standards
    solder

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    GB/T 18290.5-2000 solderless connections--Part 5:Solderless press-in connections--General requirements,test methods and practical guidance
    无焊连接 第5部分:无焊压入式连接 一般要求、试验方法和使用导则
    China National Standards
    solder

    English PDF
    GB/T 18290.4-2000 solderless connections--Part 4:Solderless non-accessible insulation displacement connections--General requirements,test methods and practical guidance
    无焊连接 第4部分:不可接触无焊绝缘位移连接 一般要求、试验方法和使用导则
    China National Standards
    solder

    English PDF
    GB/T 18290.3-2000 solderless connections--Part 3:Solderless accessible insulation displacement connections--General requirements,test methods and practical guidance
    无焊连接 第3部分:可接触无焊绝缘位移连接 一般要求、试验方法和使用导则
    China National Standards
    solder

    English PDF
    GB/T 18290.2-2000 solderless connections--Part 2:Solderless crimped connections--General requirements, test methods and practical guidance
    无焊连接 第2部分:无焊压接连接 一般要求、试验方法和使用导则
    China National Standards
    solder

    English PDF
    GB/T 5095.6-1997 Electromechanical components for electronic equipment--Basic testing proceduresand measuring methods--Part 6:Climatic tests and soldering tests
    电子设备用机电元件 基本试验规程及测量方法 第6部分:气候试验和锡焊试验
    China National Standards
    solder

    English PDF
    GB/T 5095.12-1997 Electromechanical components for electronic equipment--Basic testing procedures and measuring methods--Part 12:soldering tests--Section 6:Test 12f--Sealing against flux and cleaning solvents inmachine soldering
    电子设备用机电元件 基本试验规程及测量方法 第12部分:锡焊试验 第六篇:试验12f在机器焊接中封焊处耐焊剂和清洁剂
    China National Standards
    solder

    English PDF
    GB/T 16745-1997 Standard test method for solderability of metallic-coated products
    金属覆盖层产品钎焊性的标准试验方法
    China National Standards
    solder

    English PDF
    GB/T 7157-2019 Electric soldering irons and heating guns
    电烙铁和热风枪
    China National Standards
    solder

    English PDF

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