'Semiconducto'
China GB Standards List

GB/T 42709.7-2023
Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection
半导体器件微电子机械器件第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器

GB/T 4937.23-2023
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
半导体器件机械和气候试验方法第23部分：高温工作寿命

GB/T 42709.5-2023
Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches
半导体器件微电子机械器件第5部分：射频MEMS开关

GB/T 4937.42-2023
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
半导体器件机械和气候试验方法第42部分：温湿度贮存

GB/T 15879.604-2023
Mechanical standardization of Semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages
半导体器件的机械标准化第6-4部分：表面安装半导体器件封装外形图绘制的一般规则焊球阵列（BGA）封装的尺寸测量方法

GB/T 42706.1-2023
Electronic components - Long term storage of Semiconductor devices - Part 1: General
电子元器件半导体器件长期贮存第1部分：总则

GB/T 42706.2-2023
Electronic components - Long-term storage of Semiconductor devices - Part 2: Degradation mechanisms
电子元器件半导体器件长期贮存第2部分：退化机理

GB/T 42706.5-2023
Electronic components - Long term storage of Semiconductor devices - Part 5: Chips and wafers
电子元器件半导体器件长期贮存第5部分：芯片和晶圆

GB/T 4937.31-2023
Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin)
半导体器件机械和气候试验方法第31部分：塑封器件的易燃性（内部引起的）

GB/T 4937.32-2023
Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced)
半导体器件机械和气候试验方法第32部分：塑封器件的易燃性（外部引起的）

GB/T 4937.27-2023
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM)
半导体器件机械和气候试验方法第27部分：静电放电（ESD）敏感度测试机器模型（MM）

GB/T 8446.3-2022
Heat sinks for power Semiconductor devices—Part 3: Insulators and fasteners
电力半导体器件用散热器第3部分：绝缘件和紧固件

GB/T 8446.1-2022
Heat sinks for power Semiconductor devices—Part 1: Radiators
电力半导体器件用散热器第1部分：散热体

GB/T 8446.2-2022
Heat sinks for power Semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
电力半导体器件用散热器第2部分：热阻和流阻测量方法

GB/T 34590.11-2022
Road vehicles - Functional safety - Part 11: Guidelines for Semiconductor applications
道路车辆功能安全第11部分：半导体应用指南

GB/T 8750-2022
Gold-based bonding wire and ribbon for Semiconductor packaging
半导体封装用金基键合丝、带

SJ/T 11820-2022
Technical requirements and measurement methods for DC parameter test equipment of Semiconductor discrete devices
半导体分立器件直流参数测试设备技术要求和测量方法

GB/T 41853-2022
Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement
半导体器件微机电器件晶圆间键合强度测量

GB/T 41852-2022
Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures
半导体器件微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法

GB/T 21548-2021
Methods of measurement of the high speed Semiconductor lasers directly modulated for optical fiber communication systems
光通信用高速直接调制半导体激光器的测量方法

GB/T 7092-2021
Outline dimensions of Semiconductor integrated circuits
半导体集成电路外形尺寸

SJ/T 11777—2021
Technical requirements and measurement methods of calibrator for Semiconductor tube characteristic tracer
半导体管特性图示仪校准仪技术要求和测量方法

GB/T 41040-2021
COTS Semiconductor parts for space application -- Quality assurance requirements
宇航用商业现货（COTS）半导体器件质量保证要求

YY/T 1751-2020
Laser Therapy Equipment Semiconductor Laser Nasal Radiation Therapy Device
激光治疗设备半导体激光鼻腔内照射治疗仪

SJ/T 11761-2020
Specification for Load Ports of Semiconductor Equipment for Wafers 200mm and Smaller
200mm及以下晶圆用半导体设备装载端口规范

SJ/T 11763-2020
Specification for Human Machine Interface for Semiconductor Manufacturing Equipment
半导体制造设备人机界面规范

SJ/T 11762-2020
Semiconductor Equipment Manufacturing Information Labeling Requirements
半导体设备制造信息标识要求

GB/T 37312.1-2019
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete Semiconductors
航空电子过程管理航空航天、国防及其他高性能应用领域（ADHP）电子元器件第1部分：高可靠集成电路与分立半导体器件通用要求

GB/T 15879.4-2019
Mechanical standardization of Semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化第4部分：半导体器件封装外形的分类和编码体系

GB/T 38345-2019
General design requirements of Semiconductor integrate circuit for space application
宇航用半导体集成电路通用设计要求

GB/T 4937.14-2018
Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）
半导体器件机械和气候试验方法第14部分：引出端强度（引线牢固性）

GB/T 4937.21-2018
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
半导体器件机械和气候试验方法第21部分：可焊性

GB/T 4937.22-2018
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
半导体器件机械和气候试验方法第22部分：键合强度

GB/T 15879.5-2018
Mechanical standardization of Semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
半导体器件的机械标准化第5部分：用于集成电路载带自动焊(TAB)的推荐值

GB/T 4728.5-2018
Graphical symbols for electrical diagrams—Part 5：Semiconductors and electron tubes
电气简图用图形符号第5部分：半导体管和电子管

GB/T 4937.13-2018
Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
半导体器件机械和气候试验方法第13部分：盐雾

GB/T 4937.201-2018
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
半导体器件机械和气候试验方法第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输

GB/T 36359-2018
Semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes
半导体光电子器件小功率发光二极管空白详细规范

GB/T 4937.15-2018
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
半导体器件机械和气候试验方法第15部分：通孔安装器件的耐焊接热

GB/T 37131-2018
Nanotechnologies—Test method of Semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy
纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法

GB/T 4937.12-2018
Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
半导体器件机械和气候试验方法第12部分：扫频振动

GB/T 4937.18-2018
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
半导体器件机械和气候试验方法第18部分：电离辐照(总剂量)

GB/T 4937.19-2018
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
半导体器件机械和气候试验方法第19部分：芯片剪切强度

GB/T 4937.30-2018
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件机械和气候试验方法第30部分：非密封表面安装器件在可靠性试验前的预处理

GB/T 36646-2018
Equipment for preparation of nitride Semiconductor materials by hydride vapor phase epitaxy
制备氮化物半导体材料用氢化物气相外延设备

GB/T 4937.17-2018
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
半导体器件机械和气候试验方法第17部分：中子辐照

GB/T 4937.11-2018
Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
半导体器件机械和气候试验方法第11部分：快速温度变化双液槽法

GB/T 36005-2018
Measuring methods of optical radiation safety for Semiconductor lighting equipments and systems
半导体照明设备和系统的光辐射安全测试方法

GB/T 4937.20-2018
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
半导体器件机械和气候试验方法第20部分：塑封表面安装器件耐潮湿和焊接热综合影响

GB/T 35010.6-2018
Semiconductor die products—Part 6: Requirements for concerning thermal simulation
半导体芯片产品第6部分：热仿真要求

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'Semiconducto' China GB Standards List

'Semiconducto'
China GB Standards List