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GB standards are the China national standards; Prefix code GB are Mandatory standards, GB/T are Recommended standards; All products or service must be compliance with GB standards; If you want to export products or services to huge Chinese market, need ensure they are meet the requirements of GB china national standards; We provide Chinese GB standards and English version GB standards Lookup, Translate, Download, Imported Commodity GB standards Testing and Compliance review services. |
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 14264-2024 |
Terms of semiconductor materials 半导体材料术语 |
China National Standards semiconductor |
 English PDF |
| GB/T 43894.1-2024 |
Evaluation of near-edge geometry of semiconductor wafers - Part 1: High radial second derivative method (ZDD) 半导体晶片近边缘几何形态评价-第1部分：高度径向二阶导数法（ZDD） |
China National Standards semiconductor |
English PDF |
| GB/T 43967-2024 |
Space environment - single particle effect pulse laser test method for semiconductor devices for aerospace use 空间环境-宇航用半导体器件单粒子效应脉冲激光试验方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43777-2024 |
semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors 化妆品中功效组分虾青素的测定-高效液相色谱法 |
China National Standards semiconductor |
English PDF |
| GB/T 15651.5-2024 |
semiconductor devices - Part 5-5: Optoelectronic devices - Optocouplers 半导体器件-第5-5部分：光电子器件-光电耦合器 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.35-2024 |
semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components 半导体器件-机械和气候试验方法-第35部分：塑封电子元器件的声学显微镜检查 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.34-2024 |
semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling 半导体器件-机械和气候试验方法-第34部分：功率循环 |
China National Standards semiconductor |
English PDF |
| GB/T 43493.3-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分：缺陷的光致发光检测方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43493.2-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分：缺陷的光学检测方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43493.1-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分：缺陷分类 |
China National Standards semiconductor |
English PDF |
| GB/T 43366-2023 |
General specification for semiconductor discrete devices for aerospace applications 宇航用半导体分立器件通用规范 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.26-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) 半导体器件 机械和气候试验方法 第26部分：静电放电（ESD）敏感度测试 人体模型（HBM） |
China National Standards semiconductor |
English PDF |
| GB/T 4587-2023 |
semiconductor Devices Discrete Devices Part 7: Bipolar Transistors 半导体器件 分立器件 第7部分：双极型晶体管 |
China National Standards semiconductor |
English PDF |
| GB/T 43226-2023 |
Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications 宇航用半导体集成电路单粒子软错误时域测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43136-2023 |
Superabrasive products Grinding wheels for precision scribing of semiconductor chips 超硬磨料制品 半导体芯片精密划切用砂轮 |
China National Standards semiconductor |
English PDF |
| GB/T 43061-2023 |
semiconductor integrated circuit PWM controller test method 半导体集成电路 PWM控制器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43040-2023 |
semiconductor integrated circuit AC/DC converter test method 半导体集成电路 AC/DC变换器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43035-2023 |
semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 |
China National Standards semiconductor |
English PDF |
| GB/T 42975-2023 |
semiconductor integrated circuit driver test methods 半导体集成电路 驱动器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42974-2023 |
semiconductor integrated circuit flash memory (FLASH) 半导体集成电路 快闪存储器（FLASH） |
China National Standards semiconductor |
English PDF |
| GB/T 42973-2023 |
semiconductor integrated circuit Digital-to-analog (DA) converter 半导体集成电路 数字模拟（DA）转换器 |
China National Standards semiconductor |
English PDF |
| GB/T 42970-2023 |
semiconductor integrated circuit video encoding and decoding circuit testing method 半导体集成电路 视频编解码电路测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 20870.5-2023 |
semiconductor devices Part 16-5: Microwave integrated circuits Oscillators 半导体器件 第16-5部分：微波集成电路 振荡器 |
China National Standards semiconductor |
English PDF |
| GB/T 20870.2-2023 |
semiconductor devices Part 16-2: Microwave integrated circuits Prescalers 半导体器件 第16-2部分：微波集成电路 预分频器 |
China National Standards semiconductor |
English PDF |
| GB/T 20870.10-2023 |
semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures 半导体器件 第16-10部分：单片微波集成电路技术可接收程序 |
China National Standards semiconductor |
English PDF |
| GB/T 15651.6-2023 |
semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes 半导体器件 第5-6部分：光电子器件 发光二极管 |
China National Standards semiconductor |
English PDF |
| GB/T 42709.19-2023 |
semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass 半导体器件 微电子机械器件 第19部分：电子罗盘 |
China National Standards semiconductor |
English PDF |
| GB/T 42676-2023 |
Testing the quality of semiconductor single crystals X-ray diffraction method 半导体单晶晶体质量的测试 X射线衍射法 |
China National Standards semiconductor |
English PDF |
| GB/T 6616-2023 |
Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method 半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法 |
China National Standards semiconductor |
English PDF |
| GB/T 1555-2023 |
semiconductor single crystal crystal orientation determination method 半导体单晶晶向测定方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42848-2023 |
semiconductor integrated circuits - Test methods for direct digital frequency synthesizers 半导体集成电路 直接数字频率合成器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42839-2023 |
semiconductor integrated circuit Analog-to-digital (AD) converter 半导体集成电路 模拟数字（AD）转换器 |
China National Standards semiconductor |
English PDF |
| GB/T 42838-2023 |
semiconductor integrated circuit Hall circuit test method 半导体集成电路 霍尔电路测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42837-2023 |
Microwave semiconductor integrated circuit amplifier 微波半导体集成电路 放大器 |
China National Standards semiconductor |
English PDF |
| GB/T 42836-2023 |
Microwave semiconductor integrated circuit mixer 微波半导体集成电路 混频器 |
China National Standards semiconductor |
English PDF |
| GB/T 42835-2023 |
semiconductor integrated circuit system on chip (SoC) 半导体集成电路 片上系统（SoC） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.23-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life 半导体器件 机械和气候试验方法 第23部分：高温工作寿命 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.27-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) 半导体器件 机械和气候试验方法 第27部分：静电放电（ESD）敏感度测试 机器模型（MM） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.32-2023 |
semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) 半导体器件 机械和气候试验方法 第32部分：塑封器件的易燃性（外部引起的） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.31-2023 |
semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) 半导体器件 机械和气候试验方法 第31部分：塑封器件的易燃性（内部引起的） |
China National Standards semiconductor |
English PDF |
| GB/T 42706.5-2023 |
Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers 电子元器件 半导体器件长期贮存 第5部分：芯片和晶圆 |
China National Standards semiconductor |
English PDF |
| GB/T 42706.2-2023 |
Electronic components - Long-term storage of semiconductor devices - Part 2: Degradation mechanisms 电子元器件 半导体器件长期贮存 第2部分：退化机理 |
China National Standards semiconductor |
English PDF |
| GB/T 42706.1-2023 |
Electronic components - Long term storage of semiconductor devices - Part 1: General 电子元器件 半导体器件长期贮存 第1部分：总则 |
China National Standards semiconductor |
English PDF |
| GB/T 15879.604-2023 |
Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages 半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.42-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage 半导体器件 机械和气候试验方法 第42部分：温湿度贮存 |
China National Standards semiconductor |
English PDF |
| GB/T 42709.7-2023 |
semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection 半导体器件 微电子机械器件 第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器 |
China National Standards semiconductor |
English PDF |
| GB/T 42709.5-2023 |
semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches 半导体器件 微电子机械器件 第5部分：射频MEMS开关 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.3-2022 |
Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners 电力半导体器件用散热器 第3部分：绝缘件和紧固件 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.2-2022 |
Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 电力半导体器件用散热器 第2部分：热阻和流阻测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.1-2022 |
Heat sinks for power semiconductor devices—Part 1: Radiators 电力半导体器件用散热器 第1部分：散热体 |
China National Standards semiconductor |
English PDF |
| GB/T 8750-2022 |
Gold-based bonding wire and ribbon for semiconductor packaging 半导体封装用金基键合丝、带 |
China National Standards semiconductor |
English PDF |
| GB/T 34590.11-2022 |
Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications 道路车辆 功能安全 第11部分：半导体应用指南 |
China National Standards semiconductor |
English PDF |
| GB/T 41852-2022 |
semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards semiconductor |
English PDF |
| GB/T 41853-2022 |
semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement 半导体器件 微机电器件 晶圆间键合强度测量 |
China National Standards semiconductor |
English PDF |
| GB/T 21548-2021 |
Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems 光通信用高速直接调制半导体激光器的测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 7092-2021 |
Outline dimensions of semiconductor integrated circuits 半导体集成电路外形尺寸 |
China National Standards semiconductor |
English PDF |
| GB/T 41040-2021 |
COTS semiconductor parts for space application -- Quality assurance requirements 宇航用商业现货（COTS）半导体器件 质量保证要求 |
China National Standards semiconductor |
English PDF |
| GB/T 38345-2019 |
General design requirements of semiconductor integrate circuit for space application 宇航用半导体集成电路通用设计要求 |
China National Standards semiconductor |
English PDF |
| GB/T 15879.4-2019 |
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系 |
China National Standards semiconductor |
English PDF |
| GB/T 37312.1-2019 |
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 |
China National Standards semiconductor |
English PDF |
| GB/T 11498-2018 |
semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) |
China National Standards semiconductor |
English PDF |
| GB/T 13062-2018 |
semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
China National Standards semiconductor |
English PDF |
| GB/T 14844-2018 |
Designations of semiconductor materials 半导体材料牌号表示方法 |
China National Standards semiconductor |
English PDF |
| GB/T 37131-2018 |
Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy 纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 37031-2018 |
semiconductor lighting terminology 半导体照明术语 |
China National Standards semiconductor |
English PDF |
| GB/T 36474-2018 |
semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) 半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 36477-2018 |
semiconductor integrated circuit—Measuring methods for flash memory 半导体集成电路 快闪存储器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 36360-2018 |
semiconductor optoelectronic devices--Blank detail specification for middle power light-emitting diodes 半导体光电子器件 中功率发光二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 36358-2018 |
semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes 半导体光电子器件 功率发光二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 36359-2018 |
semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes 半导体光电子器件 小功率发光二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 4728.5-2018 |
Graphical symbols for electrical diagrams—Part 5：semiconductors and electron tubes 电气简图用图形符号 第5部分：半导体管和电子管 |
China National Standards semiconductor |
English PDF |
| GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.22-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength 半导体器件 机械和气候试验方法 第22部分：键合强度 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.21-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件 机械和气候试验方法 第21部分：可焊性 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.14-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） 半导体器件 机械和气候试验方法 第14部分：引出端强度（引线牢固性） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.201-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.13-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件 机械和气候试验方法 第13部分：盐雾 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.20-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.15-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.12-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件 机械和气候试验方法 第12部分：扫频振动 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.18-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件 机械和气候试验方法 第18部分：电离辐照(总剂量) |
China National Standards semiconductor |
English PDF |
| GB/T 4937.19-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件 机械和气候试验方法 第19部分：芯片剪切强度 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.30-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理 |
China National Standards semiconductor |
English PDF |
| GB/T 36646-2018 |
Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy 制备氮化物半导体材料用氢化物气相外延设备 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.17-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件 机械和气候试验方法 第17部分：中子辐照 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.11-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法 |
China National Standards semiconductor |
English PDF |
| GB/T 36005-2018 |
Measuring methods of optical radiation safety for semiconductor lighting equipments and systems 半导体照明设备和系统的光辐射安全测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.2-2018 |
semiconductor die products—Part 2: Exchange data formats 半导体芯片产品 第2部分：数据交换格式 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.6-2018 |
semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分：热仿真要求 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.8-2018 |
semiconductor die products—Part8: EXPRESS model schema for data exchange 半导体芯片产品 第8部分：数据交换的EXPRESS格式 |
China National Standards semiconductor |
English PDF |
| GB/T 35007-2018 |
semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35006-2018 |
semiconductor integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.5-2018 |
semiconductor die products—Part 5：Requirements for concerning electrical simulation 半导体芯片产品 第5部分：电学仿真要求 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.7-2018 |
semiconductor die products—Part 7: XML schema for data exchange 半导体芯片产品 第7部分：数据交换的XML格式 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.1-2018 |
semiconductor die products—Part 1：Requirements for procurement and use 半导体芯片产品 第1部分：采购和使用要求 |
China National Standards semiconductor |
English PDF |
| GB/T 14028-2018 |
semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.3-2018 |
semiconductor die products—Part 3: Guide for handling, packing and storage 半导体芯片产品 第3部分：操作、包装和贮存指南 |
China National Standards semiconductor |
English PDF |
| GB/T 4377-2018 |
semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.4-2018 |
semiconductor die products—Part 4: Requirements for die users and suppliers 半导体芯片产品 第4部分：芯片使用者和供应商要求 |
China National Standards semiconductor |
English PDF |
| GB/T 34971-2017 |
Guide for gaseous effluent handling in semiconductor industry 半导体制造用气体处理指南 |
China National Standards semiconductor |
English PDF |
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