![]() Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to Reliability testing 半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理 |
![]() Electric components—Reliability—Reference conditions for failure rates and stress models for conversion 电学元器件 可靠性 失效率的基准条件和失效率转换的应力模型 |
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