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'MEMS'
China GB Standards List

 GB/T 42896-2023  
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nanoscale structure impact test method
微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法
 GB/T 42895-2023  
Microelectromechanical systems (MEMS) technology Silicon-based MEMS microstructure bending strength test method
微机电系统（MEMS）技术 硅基MEMS微结构弯曲强度试验方法
 GB/T 42897-2023  
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nano-thickness film tensile strength test method
微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法
 GB/T 42709.5-2023  
Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches
半导体器件 微电子机械器件 第5部分：射频MEMS开关
 GB/T 42597-2023  
Micro-Electro-Mechanical Systems (MEMS) Technology Gyroscopes
微机电系统（MEMS）技术 陀螺仪
 GB/T 26111-2023  
Micro Electro Mechanical Systems (MEMS) Technology Terminology
微机电系统（MEMS）技术 术语
 GB/T 42191-2023  
MEMS piezoresistive pressure sensitive device performance test method
MEMS压阻式压力敏感器件性能试验方法
 GB/T 42709.7-2023  
Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection
半导体器件 微电子机械器件 第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器
 GB/T 42158-2023  
Micro-Electro-Mechanical Systems (MEMS) Technology-Description and Measurement Methods of Micro-grooves and Pyramidal Needle Structures
微机电系统（MEMS）技术 微沟槽和棱锥式针结构的描述和测量方法
 GB/T 41853-2022  
Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement
半导体器件 微机电器件 晶圆间键合强度测量
 GB/T 41852-2022  
Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures
半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
 GB/T 38447-2020  
Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration
微机电系统（MEMS）技术 MEMS结构共振疲劳试验方法
 GB/T 38446-2020  
Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films
微机电系统（MEMS）技术 带状薄膜抗拉性能的试验方法
 GB/T 38341-2019  
Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments
微机电系统（MEMS）技术 MEMS器件的可靠性综合环境试验方法
 GB/T 35086-2018  
General specification for MEMS electric field sensor
MEMS电场传感器通用技术条件
 GB/T 34900-2017  
Micro-electromechanical system technology—Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer
微机电系统（MEMS）技术 基于光学干涉的MEMS微结构残余应变测量方法
 GB/T 34893-2017  
Micro-electromechanical system technology—Measuring method for in-plane length measurements of MEMS microstructures using an optical interferometer
微机电系统（MEMS）技术 基于光学干涉的MEMS微结构面内长度测量方法
 GB/T 34899-2017  
Micro-electromechanical system technology—Measuring method of microstructure surface stress based on Raman spectroscopy
微机电系统（MEMS）技术 基于拉曼光谱法的微结构表面应力测试方法
 GB/T 34898-2017  
Micro electromechanical system technology—Test method for the nonlinear vibration of the MEMS resonant sensitive element
微机电系统（MEMS）技术 MEMS谐振敏感元件非线性振动测试方法
 GB/T 34894-2017  
Micro-electromechanical system technology—Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer
微机电系统（MEMS）技术 基于光学干涉的MEMS微结构应变梯度测量方法
 GB/T 33929-2017  
Test methods of the performance for MEMS high g accelerometer
MEMS高g值加速度传感器性能试验方法
 GB/T 33922-2017  
Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances
MEMS压阻式压力敏感芯片性能的圆片级试验方法
 GB/T 32816-2016  
Silicon-based MEMS fabrication technology—Specification for criterion of the combination of the deep etching and bonding process
硅基MEMS制造技术 以深刻蚀与键合为核心的工艺集成规范
 GB/T 32817-2016  
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS
半导体器件 微机电器件 MEMS总规范
 GB/T 32814-2016  
Silicon-based MEMS fabrication technology—Specification for criterion of the SOI wafer based MEMS process
硅基MEMS制造技术 基于SOI硅片的MEMS工艺规范
 GB/T 32815-2016  
Silicon-based MEMS fabrication technology—Specification for criterion of the bulk silicon piezoresistance process
硅基MEMS制造技术 体硅压阻加工工艺规范
 GB/T 28276-2012  
Silicon-based MEMS fabrication technology - Specification for the dissolved wafer process
硅基MEMS制造技术 体硅溶片工艺规范
 GB/T 28275-2012  
Silicon-based MEMS fabrication technology - Specification for KOH etch process
硅基MEMS制造技术 氢氧化钾腐蚀工艺规范
 GB/T 28274-2012  
Silicon-based MEMS fabrication technology - The basic regulation of layout design
硅基MEMS制造技术 版图设计基本规则
 GB/T 28277-2012  
Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area
硅基MEMS制造技术 微键合区剪切和拉压强度检测方法
 GB/T 26113-2010  
Micro-electromechanical system technology - General rules for the assessment of micro-geometrical parameters
微机电系统（MEMS）技术 微几何量评定总则
 GB/T 26112-2010  
Micro-electromechanical system technology - General rules for the assessment of micro-mechanical parameters
微机电系统（MEMS）技术 微机械量评定总则
 GB/T 26111-2010  
Micro-electromechanical system technology - Terms
微机电系统（MEMS）技术 术语
 GB/T 14006.2-1997  
Outline diMEMSions of transformers and inductors for use in telecommunication and electronic equipmemt--Part 2:Transformers and inductors using YEx-2 laminations for printed wiring boardmounting
通信和电子设备用变压器和电感器外形尺寸 第2部分:采用YEx-2系列铁心片印制板安装式变压器和电感器

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