![]() Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages 半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法 |
![]() Planar optical waveguide integrated optical circuit devices Part 2: Dense wavelength division multiplexing (DWDM) filters based on arrayed waveguide grating (AWG) technology 平面光波导集成光路器件 第2部分:基于阵列波导光栅(AWG)技术的密集波分复用(DWDM)滤波器 |
![]() Optics and photonics - Microlens arrays - Part 2: Test methods for wavefront aberrations 光学和光子学 微透镜阵列 第2部分:波前像差的测试方法 |
![]() Optics and photonics - Microlens arrays - Part 1: Terminology 光学和光子学 微透镜阵列 第1部分:术语 |
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