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GB standards are the China national standards; Prefix code GB are Mandatory standards, GB/T are Recommended standards; All products or service must be compliance with GB standards; If you want to export products or services to huge Chinese market, need ensure they are meet the requirements of GB china national standards; We provide Chinese GB standards and English version GB standards Lookup, Translate, Download, Imported Commodity GB standards Testing and Compliance review services. |
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 14048.6-2016 |
Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters) 低压开关设备和控制设备 第4-2部分：接触器和电动机起动器 交流电动机用半导体控制器和起动器(含软起动器) |
China National Standards semiconducto |
 English PDF |
| GB/T 13539.4-2016 |
Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 |
China National Standards semiconducto |
English PDF |
| GB/T 4023-2015 |
semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 |
China National Standards semiconducto |
English PDF |
| GB/T 15291-2015 |
semiconductor devices—Part 6: Thyristors 半导体器件 第6部分：晶闸管 |
China National Standards semiconducto |
English PDF |
| GB/T 31469-2015 |
semiconductor materials cutting fluid 半导体材料切削液 |
China National Standards semiconducto |
English PDF |
| GB/T 16525-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards semiconducto |
English PDF |
| GB/T 15878-2015 |
semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards semiconducto |
English PDF |
| GB/T 15876-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards semiconducto |
English PDF |
| GB/T 14112-2015 |
semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards semiconducto |
English PDF |
| GB/T 31359-2015 |
Test methods of semiconductor lasers 半导体激光器测试方法 |
China National Standards semiconducto |
English PDF |
| GB/T 31358-2015 |
General specification for semiconductor lasers 半导体激光器总规范 |
China National Standards semiconducto |
English PDF |
| GB/T 8750-2014 |
Gold bonding wire for semiconductor package 半导体封装用键合金丝 |
China National Standards semiconducto |
English PDF |
| GB/T 15877-2013 |
semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards semiconducto |
English PDF |
| GB/T 15872-2013 |
Power supply interface for semiconductor equipment 半导体设备电源接口 |
China National Standards semiconducto |
English PDF |
| GB/T 30116-2013 |
Requirements for semiconductor manufacturing facility electromagnetic compatibility 半导体生产设施电磁兼容性要求 |
China National Standards semiconducto |
English PDF |
| GB/T 29845-2013 |
Guide for final assembly, packaging,transportation, unpacking, and relocation of semiconductor manufacturing equipment 半导体制造设备的最终装配、包装、运输、拆包及安放导则 |
China National Standards semiconducto |
English PDF |
| GB/T 3859.3-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-3: Transformers and reactors 半导体变流器 通用要求和电网换相变流器 第1-3部分：变压器和电抗器 |
China National Standards semiconducto |
English PDF |
| GB/T 3859.2-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide 半导体变流器 通用要求和电网换相变流器 第1-2部分：应用导则 |
China National Standards semiconducto |
English PDF |
| GB/T 3859.1-2013 |
semiconductor converters - General requirements and line commutated Converters - Part 1-1: Specification of basic requirements 半导体变流器 通用要求和电网换相变流器 第1-1部分：基本要求规范 |
China National Standards semiconducto |
English PDF |
| GB/T 13422-2013 |
semiconductor converters - Electrical test methods 半导体变流器 电气试验方法 |
China National Standards semiconducto |
English PDF |
| GB/T 29332-2012 |
semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors(IGBT) 半导体器件 分立器件 第9部分：绝缘栅双极晶体管(IGBT) |
China National Standards semiconducto |
English PDF |
| GB/T 29299-2012 |
General specification of semiconductor laser rangefinder 半导体激光测距仪通用技术条件 |
China National Standards semiconducto |
English PDF |
| GB/T 13973-2012 |
General specification test methods for semiconductor device curve tracers 半导体管特性图示仪通用规范 |
China National Standards semiconducto |
English PDF |
| GB/T 4937.4-2012 |
semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件 机械和气候试验方法 第4部分：强加速稳态湿热试验（HAST） |
China National Standards semiconducto |
English PDF |
| GB/T 4937.3-2012 |
semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件 机械和气候试验方法 第3部分：外部目检 |
China National Standards semiconducto |
English PDF |
| GB/T 5201-2012 |
Test procedures for semiconductor charged particle detectors 带电粒子半导体探测器测量方法 |
China National Standards semiconducto |
English PDF |
| GB/T 12669-2012 |
General specification for cascade speed control assembly with semiconductor converter 半导体变流串级调速装置总技术条件 |
China National Standards semiconducto |
English PDF |
| GB/T 12667-2012 |
General specification for excitation assembly with semiconductors for synchronous motors 同步电动机半导体励磁装置总技术条件 |
China National Standards semiconducto |
English PDF |
| GB/T 26070-2010 |
Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法 |
China National Standards semiconducto |
English PDF |
| GB/T 6616-2009 |
Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge 半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法 |
China National Standards semiconducto |
English PDF |
| GB/T 1555-2009 |
Testing methods for determining the orientation of a semiconductor single crystal 半导体单晶晶向测定方法 |
China National Standards semiconducto |
English PDF |
| GB/T 14264-2009 |
semiconductor materials-terms and definitions 半导体材料术语 |
China National Standards semiconducto |
English PDF |
| GB/T 14140-2009 |
Test method for measuring diameter of semiconductor wafer 硅片直径测量方法 |
China National Standards semiconducto |
English PDF |
| GB/T 24468-2009 |
Specification for definition and measurement of semiconductor equipment reliability, availability, and maintainability(RAM) 半导体设备可靠性、可用性和维修性（RAM）的定义和测量规范 |
China National Standards semiconducto |
English PDF |
| GB/T 13539.4-2009 |
Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 |
China National Standards semiconducto |
English PDF |
| GB/T 22193-2008 |
Electrical installations in ships - Equipment - semiconductor convertors 船舶电气设备 设备 半导体变流器 |
China National Standards semiconducto |
English PDF |
| GB/T 21548-2008 |
Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems 光通信用高速直接调制半导体激光器的测量方法 |
China National Standards semiconducto |
English PDF |
| GB 14048.6-2008 |
Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters AC semiconductor motor controllers and starters(including soft-starter) 低压开关设备和控制设备 第4-2部分：接触器和电动机起动器 交流半导体电动机控制器和起动器（含软起动器） |
China National Standards semiconducto |
English PDF |
| GB/T 21226-2007 |
semiconductor convertors - Identification code for convertor connections 半导体变流器 变流联结的标识代号 |
China National Standards semiconducto |
English PDF |
| GB/T 21039.1-2007 |
semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification 半导体器件 分立器件 第4-1部分：微波二极管和晶体管 微波场效应晶体管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 20870.1-2007 |
semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 |
China National Standards semiconducto |
English PDF |
| GB/T 20726-2006 |
Instrumental specification for energy dispersive X-ray spectrometers with semiconductor detectors 半导体探测器X射线能谱仪通则 |
China National Standards semiconducto |
English PDF |
| GB/T 17574.9-2006 |
semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 17574.20-2006 |
semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 |
China National Standards semiconducto |
English PDF |
| GB/T 17574.11-2006 |
semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 14048.12-2006 |
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters-AC semiconductor controllers and contactors for non-motor loads 低压开关设备和控制设备 第4-3部分：接触器和电动机起动器-非电动机负载用交流半导体控制器和接触器 |
China National Standards semiconducto |
English PDF |
| GB/T 10236-2006 |
Guide for compatibility and protection of interference effects between semiconductor convertors and power supply system 半导体变流器与供电系统的兼容及干扰防护导则 |
China National Standards semiconducto |
English PDF |
| GB/T 4589.1-2006 |
semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 |
China National Standards semiconducto |
English PDF |
| GB/T 20516-2006 |
semiconductor devices - Discrete devices - Part 4: Microwave devices 半导体器件 分立器件 第4部分：微波器件 |
China National Standards semiconducto |
English PDF |
| GB/T 20515-2006 |
semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 |
China National Standards semiconducto |
English PDF |
| GB/T 4937.2-2006 |
semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure 半导体器件 机械和气候试验方法 第2部分:低气压 |
China National Standards semiconducto |
English PDF |
| GB/T 4937.1-2006 |
semiconductor devices―Mechanical and climatic test methods―Part 1: General 半导体器件 机械和气候试验方法 第1部分: 总则 |
China National Standards semiconducto |
English PDF |
| GB/T 20522-2006 |
semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors 半导体器件 第14-3部分: 半导体传感器-压力传感器 |
China National Standards semiconducto |
English PDF |
| GB/T 20521-2006 |
Semconductor devices Part 14-1: semiconductor sensors - General and classification 半导体器件 第14-1部分: 半导体传感器-总则和分类 |
China National Standards semiconducto |
English PDF |
| GB/T 12750-2006 |
semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) |
China National Standards semiconducto |
English PDF |
| GB/T 4326-2006 |
Extrinsic semiconductor single crystals measurement of Hall mobility and Hall coefficient 非本征半导体单晶霍尔迁移率和霍尔系数测量方法 |
China National Standards semiconducto |
English PDF |
| GB/T 13151-2005 |
semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 第6部分:晶闸管 第3篇 电流大于 100A、环境和管壳额定的反向阻断三极晶闸管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 13150-2005 |
semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 电流大于 100A、环境和管壳额定的双向三极晶闸管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 4728.5-2005 |
Graphical symbols for diagrams Part 5 semiconductors and electron tubes 电气简图用图形符号 第5部分:半导体管和电子管 |
China National Standards semiconducto |
English PDF |
| GB/T 3859.4-2004 |
semiconductor converter--Self-commutated semiconductor converters including direct d.c.converters 半导体变流器 包括直接直流变流器的半导体自换相变流器 |
China National Standards semiconducto |
English PDF |
| GB/T 2900.66-2004 |
Electrotechnical terminology--semiconductor devices and integrated circuits 电工术语 半导体器件和集成电路 |
China National Standards semiconducto |
English PDF |
| GB/T 8446.3-2004 |
Heat sink for power semiconductor device--Part 3:Insulators and fasteners 电力半导体器件用散热器 第3部分:绝缘件和紧固件 |
China National Standards semiconducto |
English PDF |
| GB/T 8446.2-2004 |
Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference 电力半导体器件用散热器 第2部分:热阻和流阻测试方法 |
China National Standards semiconducto |
English PDF |
| GB/T 8446.1-2004 |
Heat sink for power semiconductor device--Part 1:Casting kind series 电力半导体器件用散热器 第1部分:铸造类系列 |
China National Standards semiconducto |
English PDF |
| GB/T 19403.1-2003 |
semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路) |
China National Standards semiconducto |
English PDF |
| GB/T 17574.10-2003 |
semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 15651.3-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 |
China National Standards semiconducto |
English PDF |
| GB/T 15651.2-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 |
China National Standards semiconducto |
English PDF |
| GB/T 11685-2003 |
Measurement procedures for semiconductor X-ray detector system and semiconductor X-ray energyspectrometers 半导体X射线探测器系统和半导体X射线能谱仪的测量方法 |
China National Standards semiconducto |
English PDF |
| GB/T 18904.5-2003 |
semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems 半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 6589-2002 |
semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) 半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 18904.4-2002 |
semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems 半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 18904.3-2002 |
semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application 半导体器件 第12-3部分:光电子器件 显示用发光二极管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 18904.2-2002 |
semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems 半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 18904.1-2002 |
semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems 半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 18500.2-2001 |
semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 18500.1-2001 |
semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 11499-2001 |
Letter symbols for discrete semiconductor devices 半导体分立器件文字符号 |
China National Standards semiconducto |
English PDF |
| GB/T 6588-2000 |
semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes 半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 17950-2000 |
semiconductor converter--Part 6:Application guide for the protection of semiconductor converters against overcurrent by fuses 半导体变流器 第6部分:使用熔断器保护半导体变流器防止过电流的应用导则 |
China National Standards semiconducto |
English PDF |
| GB/T 5965-2000 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) 半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 17940-2000 |
semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits 半导体器件 集成电路 第3部分:模拟集成电路 |
China National Standards semiconducto |
English PDF |
| GB/T 12560-1999 |
semiconductor devices--Sectional specification for discrete devices 半导体器件 分立器件分规范 |
China National Standards semiconducto |
English PDF |
| GB/T 9424-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 7576-1998 |
semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification 半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 6590-1998 |
semiconductor devices--Discrete devices--Part6:Thyristors--Section Two:Blank detail specification for bidirectional triode thyristors(triacs)，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第二篇 100A以下环境或管壳额定的双向三极闸流晶体管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 6352-1998 |
semiconductor devices--Discrete devices--Part 6:Thyristors--Section One:Blank detail specification for reverse blocking triode thyristors，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第一篇 100A以下环境或管壳额定反向阻断三极闸流晶体管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 6351-1998 |
semiconductor devices--Discrete devices--Part 2:Rectifier diodes--Section One:Blank detail specification for rectifier diodes(including avalanche recti fier diodes)，ambient and case-rated，up to 100A 半导体器件 分立器件 第2部分:整流二极管 第一篇 100A以下环境或管壳额定整流二极管(包括雪崩整流二极管)空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 6219-1998 |
semiconductor devices--Discrete devices--Part 8:Field-effect transistors--Section One:Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz 半导体器件 分立器件 第8部分:场效应晶体管 第一篇 1 GHz、5 W以下的单栅场效应晶体管 空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 6217-1998 |
semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section One:Blank detail speci-fication for ambient-rated bipolar transistors for low and high frequency amplification 半导体器件 分立器件 第7部分:双极型晶体管 第一篇 高低频放大环境额定的双极型晶体管空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 17574-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits 半导体器件 集成电路 第2部分:数字集成电路 |
China National Standards semiconducto |
English PDF |
| GB/T 17573-1998 |
semiconductor devices--Discrete devices and integrated circuits--Part 1:General 半导体器件 分立器件和集成电路 第1部分:总则 |
China National Standards semiconducto |
English PDF |
| GB/T 17572-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 |
China National Standards semiconducto |
English PDF |
| GB/T 4023-1997 |
semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes 半导体器件 分立器件和集成电路 第2部分:整流二极管 |
China National Standards semiconducto |
English PDF |
| GB/T 17024-1997 |
semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 |
China National Standards semiconducto |
English PDF |
| GB/T 17023-1997 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 |
China National Standards semiconducto |
English PDF |
| GB/T 6798-1996 |
semiconductor integrated circuits--General principles of measuring methods of voltage comparators 半导体集成电路 电压比较器测试方法的基本原理 |
China National Standards semiconducto |
English PDF |
| GB/T 4377-1996 |
semiconductor integrated circuits--General principles of measuring methods of voltage regulator 半导体集成电路 电压调整器测试方法的基本原理 |
China National Standards semiconducto |
English PDF |
| GB/T 3436-1996 |
semiconductor integrated circuits--Series and products of operational amplifier 半导体集成电路 运算放大器系列和品种 |
China National Standards semiconducto |
English PDF |
| GB/T 16464-1996 |
semiconductor devices--Integrated circuits--Part 1:General 半导体器件 集成电路 第1部分:总则 |
China National Standards semiconducto |
English PDF |
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